Patent
Molded case for an electronic device
العنوان: | Molded case for an electronic device |
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Patent Number: | D763,854 |
تاريخ النشر: | August 16, 2016 |
Appl. No: | 29/504418 |
Application Filed: | October 06, 2014 |
Inventors: | Yu, Hsu-Sheng (Tainan, TW) |
Assignees: | Yu, Hsu-Sheng (Tainan, TW) |
Claim: | The ornamental design for a molded case for an electronic device, as shown and described. |
Current U.S. Class: | D14/440 |
Current International Class: | 1402 |
Patent References Cited: | D639296 June 2011 Tseng D718294 November 2014 Barfoot D718756 December 2014 Barfoot D719145 December 2014 Barfoot D721370 January 2015 Barfoot 9026181 May 2015 Tani D731494 June 2015 Barfoot D734760 July 2015 Brunner D736211 August 2015 Kirkpatrick D745505 December 2015 Barfoot D745525 December 2015 Bates 2009/0201254 August 2009 Rais 2012/0140396 June 2012 Zeliff |
Primary Examiner: | Underwood, Cynthia |
Attorney, Agent or Firm: | Greenberg, Laurence A. Stemer, Werner H. Locher, Ralph E. |
رقم الانضمام: | edspgr.D0763854 |
قاعدة البيانات: | USPTO Patent Grants |
الوصف غير متاح. |