Molded case for an electronic device

التفاصيل البيبلوغرافية
العنوان: Molded case for an electronic device
Patent Number: D763,854
تاريخ النشر: August 16, 2016
Appl. No: 29/504418
Application Filed: October 06, 2014
Inventors: Yu, Hsu-Sheng (Tainan, TW)
Assignees: Yu, Hsu-Sheng (Tainan, TW)
Claim: The ornamental design for a molded case for an electronic device, as shown and described.
Current U.S. Class: D14/440
Current International Class: 1402
Patent References Cited: D639296 June 2011 Tseng
D718294 November 2014 Barfoot
D718756 December 2014 Barfoot
D719145 December 2014 Barfoot
D721370 January 2015 Barfoot
9026181 May 2015 Tani
D731494 June 2015 Barfoot
D734760 July 2015 Brunner
D736211 August 2015 Kirkpatrick
D745505 December 2015 Barfoot
D745525 December 2015 Bates
2009/0201254 August 2009 Rais
2012/0140396 June 2012 Zeliff
Primary Examiner: Underwood, Cynthia
Attorney, Agent or Firm: Greenberg, Laurence A.
Stemer, Werner H.
Locher, Ralph E.
رقم الانضمام: edspgr.D0763854
قاعدة البيانات: USPTO Patent Grants