Patent
Bendable carrier mount, device and method for releasing a carrier substrate
| العنوان: | Bendable carrier mount, device and method for releasing a carrier substrate |
|---|---|
| Patent Number: | 9,296,193 |
| تاريخ النشر: | March 29, 2016 |
| Appl. No: | 14/008696 |
| Application Filed: | April 11, 2011 |
| مستخلص: | A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate. |
| Inventors: | Burggraf, Jürgen (Schärding, AT); Burgstaller, Daniel (Neuhofen im Innkreis, AT) |
| Assignees: | EV Group E. Thallner GmbH (St. Florian am Inn, AT) |
| Claim: | 1. Device for detaching a carrier substrate from a semiconductor product substrate in a detachment direction (L) wherein said detachment direction (L) is generally normal to a planar surface of said semiconductor product substrate, said device comprising: a carrier mount for holding the carrier substrate, said carrier mount including: an open ring that is flexible in the detachment direction (L) and configured to bend relative to said planar surface of the semiconductor product substrate such that at least one side of the open ring is offset above a remaining portion of the open ring to bend the carrier substrate, said open ring of said carrier mount having an adjustable diameter (D k), a substrate mount for holding the semiconductor product substrate, and detachment means for debonding of the carrier substrate from the semiconductor product substrate while bending the carrier substrate in said detachment direction (L), said detachment means including: drive means for applying at least one tensile force (F 1 , F 2 , F n) to said substrate mount in said detachment direction (L) and fixing means for applying at least one opposing force (G) to said carrier mount in a direction generally opposite said at least one tensile force (F 1 , F 2 , F n). |
| Claim: | 2. Device as claimed in claim 1 , wherein the carrier mount is elastically deformable in the detachment direction (L). |
| Claim: | 3. Device as claimed in claim 1 , wherein said drive means of said detachment means applies said at least one tensile force (F 1 , F 2 , F n) on the periphery of the substrate mount and said fixing means of said detachment means applies said at least one opposing force (G) acting against the tensile force (F 1 , F 2 , F n) on the periphery of the carrier mount to produce detachment moments (K 1 , K 2 , K n) along a detachment front. |
| Claim: | 4. Device as claimed in claim 1 , wherein the substrate mount is a rigid substrate mount having a surface that engages an entire surface of the semiconductor product substrate. |
| Claim: | 5. Device as claimed in claim 1 , wherein said detachment direction (L) extends in a generally vertical direction and said drive means of said detachment means moves said substrate mount in said detachment direction (L). |
| Claim: | 6. Device as claimed in claim 1 , wherein said drive means applies said at least one tensile force (F 1 , F 2 , F n) to said substrate mount in said detachment direction (L) and said fixing means applies said at least one opposing force (G) to said carrier mount to fix at least one side of said carrier mount relative to said detachment direction (L). |
| Claim: | 7. Device as claimed in claim 1 , further comprising a control device that controls operation of the detachment means and thereby controls application of a plurality of said tensile forces (F 1 , F 2 , F n) to the substrate mount, wherein each of said plurality of said tensile forces (F 1 , F 2 , F n) is applied at different locations on a periphery of the substrate mount to debond the carrier substrate from the semiconductor product substrate concentrically from the periphery of the semiconductor product substrate to a center of the semiconductor product substrate. |
| Claim: | 8. Device as claimed in claim 1 , further comprising a control device that controls operation of the detachment means and thereby controls application of a plurality of said tensile forces (F 1 , F 2 , F n) to the substrate mount, wherein each of said plurality of said tensile forces (F 1 , F 2 , F n) is applied at different locations on a periphery of the substrate mount to debond the carrier substrate from the semiconductor product substrate in a spiral pattern from the periphery of the semiconductor product substrate to a center of the semiconductor product substrate. |
| Claim: | 9. Device as claimed in claim 1 , wherein said open ring includes: an inside surface defining a first opening having an inside diameter (D i); a ring shoulder providing a lower surface; and a peripheral shoulder extending away from the ring shoulder, said peripheral shoulder comprised of: (i) a face surface extending generally parallel to the lower surface of the ring shoulder, and (ii) a sloping surface extending between the face surface and the lower surface of the ring shoulder, said sloping surface meeting the face surface at an inner edge, wherein said sloping surface defines a second opening having a diameter that increases from the face surface to the lower surface of the ring shoulder and wherein the adjustable diameter (D k) is defined by the inner edge. |
| Claim: | 10. Method for detaching a carrier substrate from a substantially planar semiconductor product substrate in a detachment direction (L) wherein said detachment direction (L) is generally normal to a substantially planar surface of said semiconductor product substrate, said method comprising: mounting the semiconductor product substrate to a substrate mount; mounting the carrier substrate to a carrier mount which is flexible in the detachment direction (L) for bending of the carrier substrate, said carrier mount including an open ring with an adjustable diameter (D k); applying at least one tensile force (F 1 , F 2 , F n) to said substrate mount in a first direction; and applying at least one opposing force (G) to said carrier mount in a second direction, said first direction being generally opposite to said second direction, wherein the carrier substrate mounted to the carrier mount bends in the detachment direction (L) to detach the carrier substrate from the semiconductor product substrate. |
| Claim: | 11. Method as claimed in claim 10 , wherein said detachment direction (L) extends in a generally vertical direction and said substrate mount moves in said detachment direction (L). |
| Claim: | 12. Method as claimed in claim 10 , wherein at least one side of said carrier mount is fixed to a predetermined position relative to said detachment direction (L) and at least one opposite side of said carrier mount is free to move in the detachment direction (L). |
| Claim: | 13. Flexible carrier mount for holding a carrier substrate in a process for detaching the carrier substrate from a semiconductor product substrate connected thereto, wherein the carrier mount is engageable by detachment means to bend the carrier substrate held by the carrier mount and thereby debond the carrier substrate from the semiconductor substrate, said carrier mount comprising: an open ring including: an inside surface defining a first opening having an inside diameter (D i); a ring shoulder providing a lower surface; and a peripheral shoulder extending away from the ring shoulder, said peripheral shoulder comprised of: (i) a face surface extending generally parallel to the lower surface of the ring shoulder, and (ii) a sloping surface extending between the face surface and the lower surface of the ring shoulder, said sloping surface meeting the face surface at an inner edge, wherein said sloping surface defines a second opening having a diameter that increases from the face surface to the lower surface of the ring shoulder, the second opening having a diameter (D k) defined by the inner edge. |
| Claim: | 14. Flexible carrier mount as claimed in claim 13 , wherein an angle (I) between the sloping surface of the peripheral shoulder and the lower surface of the ring shoulder is greater than 45° and less than 90°. |
| Claim: | 15. Flexible carrier mount as claimed in claim 13 , wherein said lower surface of the ring shoulder, the sloping surface of the peripheral shoulder, and the face surface of the peripheral shoulder form a Z-shaped step. |
| Claim: | 16. Flexible carrier mount as claimed in claim 13 , wherein a distance (M) between the lower surface of the ring shoulder and the face surface of the peripheral shoulder is in a range from about 250 μm to about 750 μm. |
| Claim: | 17. Flexible carrier mount as claimed in claim 13 , wherein said open ring includes an outside surface having an outside diameter (D a), wherein D i |
| Claim: | 18. Flexible carrier mount as claimed in claim 13 , wherein said carrier mount further comprises: spacing means for adjusting the diameter (D k) of the second opening, wherein the diameter (D k) of the second opening is greater than the diameter (D i) of the first opening. |
| Claim: | 19. Flexible carrier mount as claimed in claim 13 , wherein said open ring includes first and second opposing ends, wherein there is a spacing (A) between the first and second opposing ends. |
| Claim: | 20. Flexible carrier mount as claimed in claim 19 , wherein said carrier mount further comprises: spacing means for adjusting a size of the spacing (A), and thereby adjusting the inside diameter (D i) of the first opening. |
| Claim: | 21. Flexible carrier mount as claimed in claim 20 , wherein said spacing means includes first and second levers operable to modify the size of the spacing (A). |
| Claim: | 22. Flexible carrier mount as claimed in claim 13 , wherein the carrier mount further comprises: a handle attached to the open ring. |
| Patent References Cited: | 5768980 June 1998 Degen 5932048 August 1999 Furukawa et al. 6343784 February 2002 Jourde et al. 8157615 April 2012 Thallner 8267143 September 2012 George et al. 8366873 February 2013 George 8530334 September 2013 Lagahe et al. 8551291 October 2013 George 8722515 May 2014 Lagahe et al. 8950459 February 2015 George et al. 2001/0014514 August 2001 Geusic 2004/0040186 March 2004 Wilson 2004/0166653 August 2004 Kerdiles et al. 2008/0305721 December 2008 Ohashi et al. 2009/0258583 October 2009 Thallner 2009/0314430 December 2009 Nakamura 2010/0279435 November 2010 Xu 2015/0096689 April 2015 Wimplinger et al. 102290367 December 2011 103460369 December 2013 10 2008 018 536 October 2009 2 783 970 March 2000 2011-510495 March 2011 2012-4522 January 2012 200849582 December 2008 WO 00/76899 June 2000 WO 2009/090236 July 2009 |
| Other References: | International Search Report for International Application No. PCT/EP2011/055630, Nov. 7, 2011. cited by applicant Office Action issued in connection with corresponding Taiwanese Patent Application No. 101102305 (English-language translation included)dated Feb. 16, 2015. cited by applicant Office Action issued in connection with corresponding Japanese Patent Application No. JP 2014-504141, dated Nov. 4, 2014. cited by applicant U.S. Appl. No. 61/169,753, filed Apr. 16, 2009. cited by applicant U.S. Appl. No. 61/552,140, filed Oct. 27, 2011. cited by applicant Office Action issued in corresponding Japanese Patent Application No. 2014-547725, dated Nov. 16, 2015. cited by applicant Office Action issued in connection with corresponding Chinese Patent Application No. CN 201180075733.6 dated Jan. 4, 2016. cited by applicant |
| Assistant Examiner: | Harm, Nickolas |
| Primary Examiner: | Osele, Mark A |
| Attorney, Agent or Firm: | Kusner & Jaffe |
| رقم الانضمام: | edspgr.09296193 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |