Patent
Unsupported palladium alloy membranes and methods of making same
العنوان: | Unsupported palladium alloy membranes and methods of making same |
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Patent Number: | 9,044,715 |
تاريخ النشر: | June 02, 2015 |
Appl. No: | 12/197218 |
Application Filed: | August 22, 2008 |
مستخلص: | The invention provides support-free palladium membranes and methods of making these membranes. Single-gas testing of the unsupported foils produced hydrogen permeabilities equivalent to thicker membranes produced by cold-rolling. Defect-free films as thin as 7.2 microns can be fabricated, with ideal H2/N2 selectivities as high as 40,000. Homogeneous membrane compositions may also be produced using these methods. |
Inventors: | Way, J. Douglas (Boulder, CO, US); Thoen, Paul (Littleton, CO, US); Gade, Sabina K. (Westminster, CO, US) |
Assignees: | Colorado School of Mines (Golden, CO, US) |
Claim: | 1. A method of forming a free-standing hydrogen permeable palladium membrane comprising: electroless plating of a surface of a support to form a palladium membrane on the support; intentionally removing the palladium membrane from the support to produce the free-standing hydrogen permeable palladium membrane; and plating the free-standing hydrogen permeable palladium membrane with a second metal. |
Claim: | 2. The method of claim 1 , wherein the support is seeded with metallic palladium crystallites prior to the electroless plating. |
Claim: | 3. The method of claim 2 , wherein the seeding comprises contacting the support with a solution of palladium acetate in an organic solvent. |
Claim: | 4. The method of claim 2 , further comprising decomposing the palladium acetate prior to the electroless plating. |
Claim: | 5. The method of claim 4 , wherein the decomposing comprise immersing the seeded support in a 3 wt % solution of hydrogen peroxide. |
Claim: | 6. The method of claim 5 , wherein the immersing is conducted for about 30 minutes. |
Claim: | 7. The method of claim 2 , further comprising reducing the support. |
Claim: | 8. The method of claim 7 , wherein the reducing comprises contacting the support with hydrazine after the seeding. |
Claim: | 9. The method of claim 8 , wherein the contacting is conducted for about 20 minutes at about 50° C. |
Claim: | 10. The method of claim 1 , wherein the support is a stainless steel support. |
Claim: | 11. The method of claim 10 , wherein the support is a mirror-finished stainless steel support. |
Claim: | 12. The method of claim 1 , wherein the electroless plating comprises immersing the support in a palladium plating bath. |
Claim: | 13. The method of claim 12 , wherein the palladium plating bath contains no ethylenediaminetetraacetic (EDTA). |
Claim: | 14. The method of claim 1 , wherein the electroless plating comprises immersing the support in a palladium plating bath at about 50° C.; and, adding hydrazine to the plating bath. |
Claim: | 15. The method of claim 14 , wherein the hydrazine is a 3M solution of hydrazine added to the plating solution in a 100:1 ratio of plating bath to hydrazine. |
Claim: | 16. The method of claim 1 , wherein the removing comprises scoring the edge of the palladium film and lifting the film away from the support. |
Claim: | 17. The method of claim 1 , further comprising electroless plating of a second metal onto the palladium membrane to form a layered metal membrane before the removing. |
Claim: | 18. The method of claim 17 , wherein the second metal is selected from the group consisting of copper, silver and gold. |
Claim: | 19. The method of claim 17 , further comprising annealing the layered metal membrane prior to the removing. |
Claim: | 20. The method of claim 1 , wherein the second metal is selected from the group consisting of copper, silver and gold. |
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Primary Examiner: | Zhu, Weiping |
Attorney, Agent or Firm: | Sheridan Ross P.C. |
رقم الانضمام: | edspgr.09044715 |
قاعدة البيانات: | USPTO Patent Grants |
الوصف غير متاح. |