Unsupported palladium alloy membranes and methods of making same

التفاصيل البيبلوغرافية
العنوان: Unsupported palladium alloy membranes and methods of making same
Patent Number: 9,044,715
تاريخ النشر: June 02, 2015
Appl. No: 12/197218
Application Filed: August 22, 2008
مستخلص: The invention provides support-free palladium membranes and methods of making these membranes. Single-gas testing of the unsupported foils produced hydrogen permeabilities equivalent to thicker membranes produced by cold-rolling. Defect-free films as thin as 7.2 microns can be fabricated, with ideal H2/N2 selectivities as high as 40,000. Homogeneous membrane compositions may also be produced using these methods.
Inventors: Way, J. Douglas (Boulder, CO, US); Thoen, Paul (Littleton, CO, US); Gade, Sabina K. (Westminster, CO, US)
Assignees: Colorado School of Mines (Golden, CO, US)
Claim: 1. A method of forming a free-standing hydrogen permeable palladium membrane comprising: electroless plating of a surface of a support to form a palladium membrane on the support; intentionally removing the palladium membrane from the support to produce the free-standing hydrogen permeable palladium membrane; and plating the free-standing hydrogen permeable palladium membrane with a second metal.
Claim: 2. The method of claim 1 , wherein the support is seeded with metallic palladium crystallites prior to the electroless plating.
Claim: 3. The method of claim 2 , wherein the seeding comprises contacting the support with a solution of palladium acetate in an organic solvent.
Claim: 4. The method of claim 2 , further comprising decomposing the palladium acetate prior to the electroless plating.
Claim: 5. The method of claim 4 , wherein the decomposing comprise immersing the seeded support in a 3 wt % solution of hydrogen peroxide.
Claim: 6. The method of claim 5 , wherein the immersing is conducted for about 30 minutes.
Claim: 7. The method of claim 2 , further comprising reducing the support.
Claim: 8. The method of claim 7 , wherein the reducing comprises contacting the support with hydrazine after the seeding.
Claim: 9. The method of claim 8 , wherein the contacting is conducted for about 20 minutes at about 50° C.
Claim: 10. The method of claim 1 , wherein the support is a stainless steel support.
Claim: 11. The method of claim 10 , wherein the support is a mirror-finished stainless steel support.
Claim: 12. The method of claim 1 , wherein the electroless plating comprises immersing the support in a palladium plating bath.
Claim: 13. The method of claim 12 , wherein the palladium plating bath contains no ethylenediaminetetraacetic (EDTA).
Claim: 14. The method of claim 1 , wherein the electroless plating comprises immersing the support in a palladium plating bath at about 50° C.; and, adding hydrazine to the plating bath.
Claim: 15. The method of claim 14 , wherein the hydrazine is a 3M solution of hydrazine added to the plating solution in a 100:1 ratio of plating bath to hydrazine.
Claim: 16. The method of claim 1 , wherein the removing comprises scoring the edge of the palladium film and lifting the film away from the support.
Claim: 17. The method of claim 1 , further comprising electroless plating of a second metal onto the palladium membrane to form a layered metal membrane before the removing.
Claim: 18. The method of claim 17 , wherein the second metal is selected from the group consisting of copper, silver and gold.
Claim: 19. The method of claim 17 , further comprising annealing the layered metal membrane prior to the removing.
Claim: 20. The method of claim 1 , wherein the second metal is selected from the group consisting of copper, silver and gold.
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Primary Examiner: Zhu, Weiping
Attorney, Agent or Firm: Sheridan Ross P.C.
رقم الانضمام: edspgr.09044715
قاعدة البيانات: USPTO Patent Grants