IC with mixed mode RF-to-baseband interface

التفاصيل البيبلوغرافية
العنوان: IC with mixed mode RF-to-baseband interface
Patent Number: 8,812,391
تاريخ النشر: August 19, 2014
Appl. No: 13/616489
Application Filed: September 14, 2012
مستخلص: An integrated circuit (IC) includes at least one baseband section, at least one radio frequency (RF) section, and an interface module. The interface module is configured to couple the at least one baseband section to the at least one RF section, wherein the interface module includes an analog interface module and a digital interface module.
Inventors: Rofougaran, Ahmadreza (Reza) (Newport Coast, CA, US); Rofougaran, Maryam (Rancho Palos Verdes, CA, US); Hayek, Claude G. (Huntington Beach, CA, US); Hayem, Frederic Christian Marc (San Diego, CA, US); Rakshani, Vafa James (Newport Coast, CA, US); Darabi, Hooman (Laguna Niguel, CA, US)
Assignees: Broadcom Corporation (Irvine, CA, US)
Claim: 1. An integrated circuit (IC) comprises: a baseband section of a plurality of baseband sections; a radio frequency (RF) section of a plurality of RF sections; and an interface module configured to couple the baseband section of the plurality of baseband sections to the RF section of the plurality of RF sections, wherein the interface module includes: a switching matrix configured to couple the baseband section of the plurality of baseband sections to the RF section of the plurality of RF sections; an analog interface module configured to exchange analog signals with the RF section of the plurality of RF sections and the baseband section of the plurality of baseband sections; and a digital interface module configured to exchange digital signals with the RF section of the plurality of RF sections and the baseband section of the plurality of baseband sections.
Claim: 2. The IC of claim 1 further comprises: the interface module coupling the baseband section of the plurality of baseband sections to the RF section of the plurality of RF sections in a one-to-one manner based on a first wireless protocol of a multiple mode operation; and the interface module coupling a second baseband section of the plurality of baseband sections to a second RF section of the plurality of RF sections in the one-to-one manner based on a second wireless protocol of the multiple mode operation.
Claim: 3. The IC of claim 1 further comprises at least one of: the interface module coupling a pair of the plurality of baseband sections to a pair of the plurality of RF sections in a one-to-one manner based on a first redundant mode of a wireless protocol; and the interface module coupling the pair of the plurality of baseband sections to one of the plurality of RF sections in a many-to-one manner based on a second redundant mode of the wireless protocol.
Claim: 4. The IC of claim 1 further comprises: the interface module coupling at least some of the plurality of baseband sections to one of the plurality of RF sections in a many-to-one and one-to-many manner based on a multiple input multiple output mode of a wireless protocol.
Claim: 5. The IC of claim 1 further comprises: the analog interface module including an analog section of an analog to digital conversion module; and the digital interface module including a digital section of the analog to digital conversion module.
Claim: 6. The IC of claim 1 , wherein: the analog interface module provides an analog measurement of the RF section of the plurality of RF sections to the baseband section of the plurality of baseband sections; and the digital interface module provides a digital control signal from the baseband section of the plurality of baseband sections to the RF section of the plurality of RF sections.
Claim: 7. The IC of claim 6 further comprises: the analog interface module including an analog section of an analog to digital conversion module; and the digital interface module including a digital section of the analog to digital conversion module.
Claim: 8. The IC of claim 6 further comprises: the analog interface module including an analog section of digital to analog conversion module; and the digital interface module including a digital section of the digital to analog conversion module.
Claim: 9. The IC of claim 1 , wherein the interface module functions to provide an inbound symbol stream from the RF section of the plurality of RF sections to the baseband section of the plurality of baseband sections and to provide an outbound symbol stream from the baseband section of the plurality of baseband sections to the RF section of the plurality of RF sections.
Claim: 10. An integrated circuit (IC) comprises: at least one baseband section; at least one radio frequency (RF) section; and an interface module, wherein the interface module includes a measurement interface module and a control interface module, the at least one RF section provides at least one measurement to the at least one baseband section via the measurement interface module and the at least one baseband section provides at least one control signal to the at least one RF section via the control interface module, the interface module includes: a switching matrix configured to couple the at least one baseband section to the at least one RF section; an analog interface module configured to exchange analog signals with the at least one RF section and the at least one baseband section; and a digital interface module configured to exchange digital signals with the at least one RF section and the at least one baseband section.
Claim: 11. The IC of claim 10 , wherein the at least one measurement comprises at least one of: transmit power level; received signal strength level; resistor calibration measurement; capacitor calibration measurement; DC offset calibration measurement; noise measurement; signal to noise ratio; and signal to interference ratio.
Claim: 12. The IC of claim 10 , wherein the at least one control signal comprises at least one of: resistor calibration adjust; capacitor calibration adjust; transmit power adjust; gain adjust; local oscillation adjust; and transmit blocker adjust.
Claim: 13. The IC of claim 10 , wherein the interface module further comprises: an inbound symbol stream interface module coupled to provide an inbound symbol stream from the at least one RF section to the at least one baseband section; and an outbound symbol stream interface module coupled to provide an outbound symbol stream from the at least one baseband section to the at least one RF section.
Claim: 14. The IC of claim 10 further comprises: the analog interface module including an analog section of an analog to digital conversion module; and the digital interface module including a digital section of the analog to digital conversion module.
Claim: 15. The IC of claim 10 further comprises: the analog interface module including an analog section of digital to analog conversion module; and the digital interface module including a digital section of the digital to analog conversion module.
Claim: 16. An integrated circuit (IC) comprises: at least one baseband section; at least one radio frequency (RF) section; and an interface module, the interface module includes: a switching matrix configured to couple the at least one baseband section to the at least one RF section; an analog interface module configured to exchange analog signals with the at least one RF section and the at least one baseband section; and a digital interface module configured to exchange digital signals with the at least one RF section and the at least one baseband section of the plurality of baseband sections.
Claim: 17. The IC of claim 16 , wherein the interface module further comprises: an inbound symbol stream interface module coupled to provide an inbound symbol stream from the at least one RF section to the at least one baseband section; and an outbound symbol stream interface module coupled to provide an outbound symbol stream from the at least one baseband section to the at least one RF section.
Claim: 18. The IC of claim 16 , wherein the interface module further comprises: a measurement interface module and a control interface module, wherein the at least one RF section provides a measurement to the at least one baseband section via the measurement interface module and the at least one baseband section provides a control signal to the at least one RF section via the control interface module.
Claim: 19. The IC of claim 18 , wherein the measurement comprises at least one of: transmit power level; received signal strength level; resistor calibration measurement; capacitor calibration measurement; DC offset calibration measurement; noise measurement; signal to noise ratio; and signal to interference ratio.
Claim: 20. The IC of claim 18 , wherein the control signal comprises at least one of: resistor calibration adjust; capacitor calibration adjust; transmit power adjust; gain adjust; local oscillation adjust; and transmit blocker adjust.
Current U.S. Class: 705/37
Patent References Cited: 6694129 February 2004 Peterzell et al.
7069211 June 2006 Chiu et al.
7747281 June 2010 Preston et al.
7809049 October 2010 Rofougaran
7957457 June 2011 Rofougaran
8090327 January 2012 Rofougaran
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8401497 March 2013 Rofougaran
8526893 September 2013 Rofougaran
2004/0204036 October 2004 Yang
2005/0262278 November 2005 Schmidt
2006/0052124 March 2006 Pottenger et al.
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2012/0108183 May 2012 Rofougaran
Primary Examiner: Poinvil, Frantzy
Attorney, Agent or Firm: Garlick & Markison
Smith, Kevin L.
رقم الانضمام: edspgr.08812391
قاعدة البيانات: USPTO Patent Grants