Patent
Method of analyzing iron concentration of boron-doped P-type silicon wafer and method of manufacturing silicon wafer
| العنوان: | Method of analyzing iron concentration of boron-doped P-type silicon wafer and method of manufacturing silicon wafer |
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| Patent Number: | 8,481,346 |
| تاريخ النشر: | July 09, 2013 |
| Appl. No: | 13/191740 |
| Application Filed: | July 27, 2011 |
| مستخلص: | An aspect of the present invention relates to a method of analyzing an iron concentration of a boron-doped p-type silicon wafer by a SPV method, which comprises subjecting the wafer to Fe—B pair separation processing by irradiation with light and determining the iron concentration based on a change in a minority carrier diffusion length following the separation processing. The iron concentration is calculated with a calculation equation comprising a minority carrier diffusion length LAF1 measured after the separation processing, a minority carrier diffusion length LAF2 measured after a prescribed time has elapsed following measurement of LAF1, and dependence on time of recombination of Fe—B pairs separated by the separation processing. The calculation equation is derived by assuming that the irradiation with light causes boron atoms and oxygen atoms in the wafer to form a bonded product, and by assuming that the bonded product has identical influences on LAF1 and LAF2. |
| Inventors: | Ohno, Ryuji (Kanagawa, JP); Iga, Fumio (Saitama, JP) |
| Assignees: | Sumco Corporation (Tokyo, JP) |
| Claim: | 1. A method of analyzing an iron concentration of a boron-doped p-type silicon wafer by a surface photovoltage method, which comprises: subjecting the boron-doped p-type silicon wafer to Fe—B pair separation processing by irradiation with light, and determining the iron concentration based on a change in a minority carrier diffusion length following the Fe—B pair separation processing, wherein the iron concentration is calculated with a calculation equation, the calculation equation comprising parameters in the form of a minority carrier diffusion length L AF1 measured after the separation processing, a minority carrier diffusion length L AF2 measured after a prescribed time has elapsed following measurement of L AF1 , and dependence on time of recombination of Fe—B pairs that have been separated by the separation processing, and the calculation equation is derived by assuming that the irradiation with light causes boron atoms and oxygen atoms that are present in the silicon wafer to form a bonded product, and by assuming that the bonded product has identical influences on L AF1 and L AF2 . |
| Claim: | 2. The method of analyzing according to claim 1 , wherein the calculation equation is the following equation (6): [mathematical expression included] wherein, in equation (6), N Fe denotes the iron concentration, F AF1 denotes the dependence on time of recombination of Fe—B pairs calculated from the following equation (1) at the time of measurement of L AF1 , F AF2 denotes the dependence on time of recombination of Fe—B pairs calculated from the following equation (1) at the time of measurement of L AF2 , C FeB denotes an electron capture coefficient of Fe—B pairs, C Fei denotes an electron capture coefficient of Fei, and D n denotes an electron diffusion constant; F =exp(−τ C −1 t) (1) wherein, in equation (1), F denotes dependence on time of recombination of Fe—B pairs, τc denotes a capture ratio, and t denotes a passage of time following irradiation with light. |
| Claim: | 3. The method of analyzing according to claim 1 , wherein the method is conducted with an analysis device comprising a light irradiating part that irradiates the light, a measuring part that measures the diffusion length, and a displacement means that displaces the silicon wafer being analyzed between the measurement part and the light irradiating part. |
| Claim: | 4. A silicon wafer to which a written quality guarantee is attached, wherein an iron concentration determined by the method of analyzing according to claim 1 is recorded on the written quality guarantee. |
| Claim: | 5. A method of manufacturing a boron-doped p-type silicon wafer, which comprises: preparing a lot of silicon wafers containing multiple boron-doped p-type silicon wafers; extracting at least one silicon wafer from the lot; determining an iron concentration of the silicon wafer that has been extracted by the method of analyzing according to claim 1 ; and shipping a silicon wafer as a product wafer, the silicon wafer being within the same lot as the extracted silicon wafer the iron concentration of which has been determined to be at or below a threshold. |
| Current U.S. Class: | 438/18 |
| Patent References Cited: | 5742176 April 1998 Kato et al. 7141992 November 2006 Ohno et al. 7244306 July 2007 Kurita et al. 2006/0066324 March 2006 Ohno et al. 2005-064054 March 2005 2005-317562 November 2005 |
| Primary Examiner: | Chaudhari, Chandra |
| Attorney, Agent or Firm: | Greenblum & Bernstein, P.L.C. |
| رقم الانضمام: | edspgr.08481346 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |