Group-III nitride vertical-rods substrate

التفاصيل البيبلوغرافية
العنوان: Group-III nitride vertical-rods substrate
Patent Number: 7,709,823
تاريخ النشر: May 04, 2010
Appl. No: 11/552527
Application Filed: October 25, 2006
مستخلص: The invention is directed to a group-III nitride vertical-rods substrate. The group-III vertical-rods substrate comprises a substrate, a buffer layer and a vertical rod layer. The buffer layer is located over the substrate. The vertical rod layer is located on the buffer layer and the vertical rod layer is comprised of a plurality of vertical rods standing on the buffer layer.
Inventors: Lai, Chih-Ming (Pingtung County, TW); Liu, Wen-Yueh (Taipei, TW); Tsay, Jenq-Dar (Kaohsiung, TW); Hsu, Jung-Tsung (Hsinchu, TW); Gwo, Shang-Jr (Hsinchu, TW); Shen, Chang-Hong (Yilan County, TW); Lin, Hon-Way (Taipei, TW)
Assignees: Industrial Technology Research Institute (Hsinchu, TW), National Tsing Hua University (Hsinchu, TW)
Claim: 1. A group-III nitride vertical-rods substrate, comprising: a substrate; a buffer layer located over the substrate; a vertical rod layer located on the buffer layer, wherein the vertical rod layer is comprised of a plurality of vertical rods standing on the buffer layer; and each of the vertical rods is directly in contact with the buffer layer and the plurality of vertical rods and the buffer layer are made of different materials and a portion of a surface of the buffer layer is exposed between the vertical rods a group-III nitride semiconductor layer extending substantially across an entire area above the vertical rod layer.
Claim: 2. The group-III nitride vertical-rods substrate of claim 1 , wherein the material of each of the vertical rod includes group-III nitride.
Claim: 3. The group-III nitride vertical-rods substrate of claim 1 , wherein the material of each of the vertical rod includes gallium nitride.
Claim: 4. The group-III nitride vertical-rods substrate of claim 1 , wherein the buffer layer is a multi-layered layer.
Claim: 5. The group-III nitride vertical-rods substrate of claim 4 , wherein the multi-layered layer comprises a group-III nitride layer and a silicon nitride layer stacked on the group-III nitride layer.
Claim: 6. The group-III nitride vertical-rods substrate of claim 4 , wherein the thickness of the buffer layer is about 1-60 nano meters.
Claim: 7. The group-III nitride vertical-rods substrate of claim 1 , wherein the material of the buffer layer includes silicon nitride.
Claim: 8. The group-III nitride vertical-rods substrate of claim 7 , wherein the thickness of the buffer layer is less than 10 nano meters.
Claim: 9. The group-III nitride vertical-rods substrate of claim 1 , wherein a diameter of a cross-section of each of the vertical rods is about 60-150 nano meters.
Claim: 10. The group-III nitride vertical-rods substrate of claim 1 , wherein the thickness of the vertical rod layer is about 10 nano meters 5 micrometers.
Claim: 11. The group-III nitride vertical-rods substrate of claim 1 , wherein the distribution density of the vertical rods of the vertical rod layer over the substrate is about 109/cm2-1012/cm2.
Claim: 12. The group-III nitride vertical-rods substrate of claim 1 , wherein the thickness of the group-III nitride semiconductor layer is larger than 20 micrometers.
Claim: 13. A group-III nitride vertical-rods substrate, comprising: a substrate; a vertical rod layer located over the substrate, wherein the vertical rod layer is comprised of a plurality of vertical rods standing on a buffer layer over the substrate; and a group-III nitride semiconductor layer extending substantially across an entire area above the vertical rod layer, wherein the thickness of the group-III nitride semiconductor layer is larger than 20 micrometers.
Claim: 14. The group-III nitride vertical-rods substrate of claim 13 , wherein the material of each of the vertical rod includes group-III nitride.
Claim: 15. The group-III nitride vertical-rods substrate of claim 13 , wherein the material of each of the vertical rod includes gallium nitride.
Claim: 16. The group-III nitride vertical-rods substrate of claim 13 , wherein the buffer layer is a multi-layered layer.
Claim: 17. The group-III nitride vertical-rods substrate of claim 16 , wherein the multi-layered layer comprises a group-III nitride layer and a silicon nitride layer stacked on the group-III nitride layer.
Claim: 18. The group-III nitride vertical-rods substrate of claim 13 , wherein the material of the buffer layer includes silicon nitride.
Claim: 19. The group-III nitride vertical-rods substrate of claim 13 , wherein a diameter of a cross-section of each of the vertical rods is about 60-150 nano meters.
Claim: 20. The group-III nitride vertical-rods substrate of claim 13 , wherein the thickness of the vertical rod layer is about 10 nano meters-5 micrometers.
Claim: 21. The group-III nitride vertical-rods substrate of claim 13 , wherein the distribution density of the vertical rods of the vertical rod layer over the substrate is about 109/cm2-1012/cm2.
Current U.S. Class: 257/9
Patent References Cited: 2002/0192441 December 2002 Kalkan et al.
2004/0157358 August 2004 Hiramatsu et al.
2005/0082543 April 2005 Alizadeh et al.
2005/0179052 August 2005 Yi et al.
2005/0194598 September 2005 Kim et al.
2005/0208302 September 2005 Yi et al.
2005/0235904 October 2005 Lee et al.
2006/0091408 May 2006 Kim et al.
1659713 August 2005
11-265853 September 1999
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Assistant Examiner: Chhaya, Swapneel
Primary Examiner: Richards, N Drew
Attorney, Agent or Firm: Jianq Chyun IP Office
رقم الانضمام: edspgr.07709823
قاعدة البيانات: USPTO Patent Grants