Patent
Encapsulation for oled devices
| العنوان: | Encapsulation for oled devices |
|---|---|
| Patent Number: | 7,255,823 |
| تاريخ النشر: | August 14, 2007 |
| Appl. No: | 10/363931 |
| Application Filed: | September 06, 2000 |
| مستخلص: | An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths. |
| Inventors: | Guenther, Ewald Karl Michael (Regenstauf, DE); Auch, Mark Dai Joong (Singapore, SG) |
| Assignees: | Institute of Materials Research and Engineering (Singapore, SG), Osram Opto Semiconductor GmbH (DE) |
| Claim: | 1. A device comprising: a substrate having a cell region; a sealing dam surrounding the cell region; a cap supported by the sealing dam; a sealing region abutting an outer surface of the sealing dam; and a sealant located in the sealing region, the sealant hermetically sealing the device, wherein the sealing dam includes at least one material from a group consisting of photoresist, spin-on glass, polyimide, polybenzoxazole, polyglutarimide, benzocyclobutene, polyethylene, polystyrene, polypropylene, silicon nitride and aluminum oxide. |
| Claim: | 2. The device of claim 1 wherein the cell region comprises organic light emitting diode cells. |
| Claim: | 3. The device of claim 1 wherein the sealant comprises an adhesive. |
| Claim: | 4. The device of claim 1 wherein the cap extends past the sealing dam to provide an overhang, and the sealant spans a space between the overhang and the substrate. |
| Claim: | 5. The device of claim 1 wherein the sealing dam abuts the substrate. |
| Claim: | 6. The device of claim 1 wherein the substrate comprises a flexible substrate. |
| Claim: | 7. The device of claim 6 wherein the substrate comprises a transparent substrate. |
| Claim: | 8. The device of claim 1 wherein the substrate comprises a transparent substrate. |
| Claim: | 9. The device of claim 1 wherein the sealing dam comprises a non-conductive material. |
| Claim: | 10. The device of claim 9 wherein the sealant comprises a thermally cured sealant. |
| Claim: | 11. The device of claim 9 wherein the sealing dam comprises a photosensitive material. |
| Claim: | 12. The device of claim 11 wherein the sealant comprises a thermally cured sealant. |
| Claim: | 13. The device of claim 9 wherein the sealing dam comprises multiple layers. |
| Claim: | 14. The device of claim 13 wherein at least a bottom layer of the sealing dam in contact with the substrate comprises non-conductive material. |
| Claim: | 15. The device of claim 14 wherein the sealant comprises a thermally cured sealant. |
| Claim: | 16. The device of claim 13 wherein the sealant comprises a thermally cured sealant. |
| Claim: | 17. A method for forming a device including encapsulating the device comprising: providing a substrate including a cell region; providing a cap with a sealing dam; mounting the cap on the substrate, wherein the sealing dam surrounds the cell region and forms a sealing region abutting an outer surface of the sealing dam; exerting a pressure to ensure the sealing dam contacts the substrate; and applying a sealant in the sealing region, the sealant hermetically sealing the cell region, wherein the sealing dam includes at least one material from a group consisting of photoresist, spin-on glass, polyimide, polybenzoxazole, polyglutarimide, benzocyclobutene, polyethylene, polystyrene, polypropylene, silicon nitride and aluminum oxide. |
| Claim: | 18. The method of claim 17 wherein providing the substrate includes forming organic light emitting diode cells in the cell region of the substrate. |
| Claim: | 19. The method of claim 17 wherein the sealant comprises an adhesive. |
| Claim: | 20. The method of claim 17 wherein the cap extends past the sealing dam to provide an overhang, and the sealant spans a space between the overhang and the substrate. |
| Claim: | 21. The method of claim 17 wherein the sealing dam abuts the substrate. |
| Claim: | 22. The method of claim 17 wherein the substrate comprises a flexible substrate. |
| Claim: | 23. The method of claim 22 wherein the substrate comprises a transparent substrate. |
| Claim: | 24. The method of claim 17 wherein the substrate comprises a transparent substrate. |
| Claim: | 25. The method of claim 17 wherein providing the cap with the sealing dam comprises forming a sealing dam on a cap substrate. |
| Claim: | 26. The method of claim 25 further comprising curing the sealant. |
| Claim: | 27. The method of claim 25 wherein forming the sealing dam comprises: depositing a device layer on the cap substrate; and patterning the device layer to form the sealing dam on the cap substrate. |
| Claim: | 28. The method of claim 27 further comprising curing the adhesive. |
| Claim: | 29. The method of claim 27 wherein the device layer comprises a photosensitive layer. |
| Claim: | 30. The method of claim 29 further comprising curing the sealant. |
| Claim: | 31. The method of claim 25 wherein the sealing dam comprises a photosensitive material. |
| Claim: | 32. The method of claim 31 further comprising curing the sealant. |
| Claim: | 33. A method for forming a device including encapsulating the device comprising: providing a substrate including a cell region; forming a sealing dam on the substrate, wherein the sealing dam surrounds the cell region; mounting a cap on the sealing dam, wherein a sealing region abuts an outer surface of the sealing dam; exerting a pressure to ensure the cap contacts the sealing dam; and applying a sealant in the sealing region, the sealant hermetically sealing the cell region, wherein the sealing dam includes at least one material from a group consisting of photoresist, spin-on glass, polyimide, polybenzoxazole, polyglutarimide, benzocyclobutene, polyethylene, polystyrene, polypropylene, silicon nitride and aluminum oxide. |
| Claim: | 34. The method of claim 33 wherein providing the substrate includes forming organic light emitting diode cells in the cell region of the substrate. |
| Claim: | 35. The method of claim 33 wherein the sealant comprises an adhesive. |
| Claim: | 36. The method of claim 33 wherein the cap extends past the sealing dam to provide an overhang, and the sealant spans a space between the overhang and the substrate. |
| Claim: | 37. The method of claim 33 wherein the sealing dam abuts the substrate. |
| Claim: | 38. The method of claim 33 wherein the substrate comprises a flexible substrate. |
| Claim: | 39. The method of claim 38 wherein the substrate comprises a transparent substrate. |
| Claim: | 40. The method of claim 33 wherein the substrate comprises a transparent substrate. |
| Claim: | 41. The method of claim 33 wherein forming the sealing dam comprises: depositing a device layer on the substrate; and patterning the device layer to form the sealing dam on the substrate. |
| Claim: | 42. The method of claim 41 wherein the device layer comprises a photosensitive layer. |
| Claim: | 43. The method of claim 42 further comprising curing the sealant. |
| Claim: | 44. The method of claim 41 further comprising curing the sealant. |
| Claim: | 45. The method of claim 33 wherein the sealing dam comprises a photosensitive material. |
| Claim: | 46. The method of claim 45 further comprising curing the sealant. |
| Claim: | 47. The device of claim 1 further comprising a cavity configured to separate the cap from the cell region, the cavity being positioned adjacent to an inner surface of the sealing dam. |
| Claim: | 48. The device of claim 1 further comprising a cavity configured to separate the cap from a cell positioned in the cell region. |
| Current U.S. Class: | 264/263 |
| Patent References Cited: | 4253741 March 1981 Nakauchi et al. 5041395 August 1991 Steffen 5577319 November 1996 Knecht 5610742 March 1997 Hinata et al. 5687465 November 1997 Hinata et al. 5714838 February 1998 Haight et al. 5964030 October 1999 Lee et al. 5965907 October 1999 Huang et al. 6022583 February 2000 Falcone et al. 6219126 April 2001 Von Gutfeld 6222603 April 2001 Sakai et al. 6399004 June 2002 Slager 6650392 November 2003 Iwanaga et al. 6734942 May 2004 Takeuchi 6791660 September 2004 Hayashi et al. 2004/0217703 November 2004 Wittmann et al. 0 986 112 March 2000 WO 98/28767 July 1998 WO 98/28947 July 1998 WO 98/59528 December 1998 WO 00/16361 March 2000 WO 00/16362 March 2000 |
| Other References: | Burroughs et al., “Light-emitting diodes based on conjugated polymers”, 1990, Nature, vol. 347, 539-541, London, 1990. cited by other |
| Primary Examiner: | Lee, Edmund H. |
| Attorney, Agent or Firm: | Fish & Richardson P.C. |
| رقم الانضمام: | edspgr.07255823 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |