Patent
Wafer-based planning methods and systems for batch-based processing tools
| العنوان: | Wafer-based planning methods and systems for batch-based processing tools |
|---|---|
| Patent Number: | 7,206,653 |
| تاريخ النشر: | April 17, 2007 |
| Appl. No: | 11/288489 |
| Application Filed: | November 29, 2005 |
| مستخلص: | Computer-implemented wafer-based planning methods for batch-based processing tools. Tool groups are appended in a tool group level of planning data provided by a MES for converting planning data from batch-based to wafer-based data. The planning data with appended tool group is applied to dispatch processing tools. |
| Inventors: | Ou, Ming-Feng (Hsinchu, TW); Fang, Gwo-Chiang (Pingjhen, TW); Chang, Chao-Fan (Hsinchu, TW); Chen, Ju-Kau (Changhua, TW); Wu, Oliver (Nanjhuang Township, Miaoli County, TW) |
| Assignees: | Taiwan Semiconductor Manufacturing Co., Ltd. (Hsinchu, TW) |
| Claim: | 1. A computer-implemented wafer-based planning method for batch-based processing tools, comprising: providing planning data, comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of appended tool groups depends on the wafer capacity of the batch-based processing tool. |
| Claim: | 2. The computer-implemented wafer-based planning method for batch-based processing tools of claim 1 , further appending tool group selection rules corresponding to the appended tool groups. |
| Claim: | 3. The computer-implemented wafer-based planning method for batch-based processing tools of claim 2 , wherein when wafers arrive at the batch-based processing tool, a target tool group is selected from the tool groups from the tool group level according to the number of wafers and the tool group selection rules. |
| Claim: | 4. The computer-implemented wafer-based planning method for batch-based processing tools of claim 1 , wherein the planning data is provided by a manufacturing execution system for the batch-based processing tools. |
| Claim: | 5. The computer-implemented wafer-based planning method for batch-based processing tools of claim 1 , wherein the planning data with the appended tool groups is provided to the batch-based processing tools for wafer dispatch. |
| Claim: | 6. The computer-implemented wafer-based planning method for batch-based processing tools of claim 1 , wherein the appended tool groups are indexed from one to the maximum wafer capacity of the batch-based processing tool. |
| Claim: | 7. A wafer-based planning system for batch-based processing tools, comprising: a database providing planning data comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and an appending module, coupled to the database, appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of the appended tool groups depends on the wafer capacity of the batch-based processing tool. |
| Claim: | 8. The wafer-based planning system for batch-based processing tools of claim 7 , wherein the appending module further appends tool group selection rules corresponding to the appended tool groups. |
| Claim: | 9. The wafer-based planning system for batch-based processing tools of claim 8 , wherein when wafers arrive at the batch-based processing tool, a target tool group is selected from the tool groups according to the number of wafers and the tool group selection rules. |
| Claim: | 10. The wafer-based planning system for batch-based processing tools of claim 7 , wherein the database is provided by a manufacturing execution system for the batch-based processing tools. |
| Claim: | 11. The wafer-based planning system for batch-based processing tools of claim 7 , wherein the planning data with the appended tool groups is provided to the batch-based processing tools for wafer dispatch. |
| Claim: | 12. The wafer-based planning system for batch-based processing tools of claim 7 , wherein the appended tool groups are indexed from one to the maximum wafer capacity of the batch-based processing tool. |
| Claim: | 13. An integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools, the method comprising: providing planning data, comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of the appended tool groups depends on the wafer capacity of the batch-based processing tool. |
| Claim: | 14. The integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools of claim 13 , the method further appending tool group selection rules corresponding to the appended tool groups. |
| Claim: | 15. The integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools of claim 14 , wherein when wafers arrive at the batch-based processing tool, a target tool group is selected from the tool groups according to the number of wafers and the tool group selection rules. |
| Claim: | 16. The integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools of claim 13 , wherein the planning data is provided by a manufacturing execution system for the batch-based processing tools. |
| Claim: | 17. The integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools of claim 13 , wherein the planning data with the appended tool groups is provided to the batch-based processing tools for wafer dispatch. |
| Claim: | 18. The integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools of claim 13 , wherein the appended tool groups are indexed from one to the maximum wafer capacity of the batch-based processing tool. |
| Current U.S. Class: | 700/99 |
| Patent References Cited: | 6687563 February 2004 Wang et al. 7027885 April 2006 Barto et al. 7043322 May 2006 Denton et al. 2002/0116086 August 2002 Huber et al. 2002/0160621 October 2002 Joma et al. 2003/0120371 June 2003 Joma et al. 2003/0225474 December 2003 Mata et al. 2005/0113950 May 2005 Brown 2005/0256599 November 2005 Peng 2006/0074522 April 2006 Liang et al. 2006/0265162 November 2006 Muro et al. |
| Primary Examiner: | Von Buhr, M. N. |
| Attorney, Agent or Firm: | Thomas, Kayden, Horstemeyer & Risley |
| رقم الانضمام: | edspgr.07206653 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |