Patent
Copper foil for printed circuit board with taking environmental conservation into consideration
| العنوان: | Copper foil for printed circuit board with taking environmental conservation into consideration |
|---|---|
| Patent Number: | 7,108,923 |
| تاريخ النشر: | September 19, 2006 |
| Appl. No: | 11/247297 |
| Application Filed: | October 12, 2005 |
| مستخلص: | A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cm2 of chromium converted into metallic chromium. |
| Inventors: | Ito, Yasuyuki (Tsuchiura, JP); Matsumoto, Katsuyuki (Hitachi, JP); Yokomizo, Kenji (Taito, JP); Kusano, Yasuhiro (Inashiki-gun, JP); Shimizu, Shinichiro (Abiko, JP); Kodaira, Muneo (Tsuchiura, JP); Nomura, Katsumi (Tsuchiura, JP) |
| Assignees: | Hitachi Cable, Ltd. (Tokyo, JP) |
| Claim: | 1. A copper foil for a printed circuit board, comprising: a rust preventing layer formed by a trivalent chromium chemical conversion treatment on the copper foil; and an alloy plating layer formed under the rust preventing layer, wherein the copper foil comprises copper or copper alloy, the rust preventing layer comprises 0.5 to 2.5 μg/cm 2 of chromium, the alloy plating layer comprises nickel and cobalt the total amount of which is 5 to 20 μg/cm 2 , and the alloy plating layer comprises cobalt whose concentration in the alloy plating layer is 60 to 80% by mass. |
| Claim: | 2. The copper foil for the printed circuit board according to claim 1 , further comprising: a zinc galvanized layer formed between the rust preventing layer and the alloy plating layer, wherein the zinc galvanized layer comprises 0.5 to 3 μg/cm 2 of zinc. |
| Claim: | 3. The copper foil for the printed circuit board according to claim 1 , further comprising: a roughening treatment layer formed under the alloy plating layer; and a copper plating treatment layer formed under or on the roughening treatment layer. |
| Claim: | 4. The copper foil for the printed circuit board according to claim 2 , further comprising: a roughening treatment layer formed under the alloy plating layer; and a copper plating treatment layer formed under or on the roughening treatment layer. |
| Claim: | 5. The copper foil for the printed circuit board according to claim 1 , further comprising: a silane coupling treatment layer formed on the rust preventing layer, wherein the silane coupling treatment layer is made by heating and drying a silane coupling treating agent at a temperature of 150 to 300° C. |
| Claim: | 6. A copper foil for a printed circuit board, comprising: a rust preventing layer formed by a trivalent chromium chemical conversion treatment on the copper foil; and an alloy plating layer formed under the rust preventing layer, wherein the copper foil comprises at least one of copper and copper alloy, the alloy plating layer comprises nickel and cobalt, the total amount of which is 5 to 20 μg/cm 2 , and the alloy plating layer comprises cobalt whose concentration in the alloy plating layer is 60 to 80% by mass. |
| Claim: | 7. The copper foil for the printed circuit board according to claim 6 , further comprising: a zinc galvanized layer formed between the rust preventing layer and the alloy plating layer, wherein the zinc galvanized layer comprises 0.5 to 3 μg/cm 2 of zinc. |
| Claim: | 8. The copper foil for the printed circuit board according to claim 6 , further comprising: a roughening treatment layer formed under the alloy plating layer; and a copper plating treatment layer formed at least one of under and on the roughening treatment layer. |
| Claim: | 9. The copper foil for the printed circuit board according to claim 7 , further comprising: a roughening treatment layer formed under the alloy plating layer; and a copper plating treatment layer formed at least one of under and on the roughening treatment layer. |
| Claim: | 10. The copper foil for the printed circuit board according to claim 6 , further comprising: a silane coupling treatment layer formed on the rust preventing layer, wherein the silane coupling treatment layer is made by heating and drying a silane coupling treating agent at a temperature of 150 to 300° C. |
| Current U.S. Class: | 428/675 |
| Patent References Cited: | 6132589 October 2000 Ameen et al. 52-145769 December 1977 06-54829 July 1994 3142259 December 2000 2005-008972 January 2005 2005-042139 February 2005 WO 97/04627 February 1997 |
| Primary Examiner: | Lavilla, Michael E. |
| Attorney, Agent or Firm: | McGinn IP Law Group, PLLC |
| رقم الانضمام: | edspgr.07108923 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |