Patent
Method of making circuit assembly with hardened direct bond lead frame
| العنوان: | Method of making circuit assembly with hardened direct bond lead frame |
|---|---|
| Patent Number: | 4,788,765 |
| تاريخ النشر: | December 06, 1988 |
| Appl. No: | 07/120,626 |
| Application Filed: | November 13, 1987 |
| مستخلص: | In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fastener connection (12) to the lead frames without collapse thereof. |
| Inventors: | Kaufman, Lance R. (Mequon, WI); Dombeck, John A. (Glendale, WI); Frederickson, Herbert O. (Milwaukee, WI) |
| Assignees: | Gentron Corporation (Milwaukee, WI) |
| Claim: | We claim |
| Claim: | 1. A method of making an electric circuit assembly comprising |
| Claim: | providing an electrically insulting thermally conductive nonmetallic refractory substrate; |
| Claim: | providing electrically conductive metallic lead frame means; |
| Claim: | directly bonding said lead frame means to said substrate by placing said lead frame means in contact with said substrate, heating said lead frame means and said substrate to a temperature below the melting point of said metallic lead frame means to form a eutectic with said lead frame means which wets said lead frame means and said substrate, and cooling said lead frame means and said substrate with said lead frame means bonded to said substrate; |
| Claim: | work hardening said lead frame means to stiffen said lead frame means and enable push-on fastener connection to said lead frame means without collapse thereof. |
| Claim: | 2. The invention according to claim 1 wherein said substrate has a planar horizontal top surface, and said lead frame means includes a first horizontal portion lying flat on said top surface of said substrate and a second portion integral with said first portion and extending therefrom to provide a terminal for external circuit connection, and wherein said work hardening comprises applying pressure to said second lead frame portion such that said second lead frame portion hardens and resists deformation upon push-on fastener connection to said second lead frame portion. |
| Claim: | 3. The invention according to claim 2 comprising providing flat coplanar said first and second lead frame portions, directly bonding said first lead frame portion to said substrate, work hardening said second lead frame portion and the junction between said first and second lead frame portions by applying pressure thereto, bending said second lead frame portion substantially 90.degree. from said first lead frame portion to extend vertically upwardly from said substrate, wherein said junction between said first and second lead frame portions is a right angle bend hardened against deformation. |
| Claim: | 4. The invention according to claim 2 wherein said work hardening comprises rolling said second lead frame portion. |
| Claim: | 5. The invention according to claim 4 wherein said second lead frame portion extends laterally beyond said substrate, and comprising providing a support adjacent said substrate and beneath said second lead frame portion, and rolling said second lead frame portion against said support. |
| Claim: | 6. The invention according to claim 2 wherein said work hardening comprises stamping said second lead frame portion. |
| Claim: | 7. The invention according to claim 6 wherein said second lead frame portion extends laterally beyond said substrate, and comprising providing a support adjacent said substrate and beneath said second lead frame portion, and stamping said second lead frame portion against said support, without stamping said first lead frame portion. |
| Current U.S. Class: | 29/827; 174/522; 174/524; 357/70 |
| Current International Class: | H01R 4300 |
| Patent References Cited: | 3404319 October 1968 Tsuji et al. 3537175 November 1970 St. Clair et al. 3544857 December 1970 Byrne et al. 3684464 August 1972 Happ et al. 3744120 July 1973 Burgess et al. 3766634 October 1973 Babcock et al. 3768986 October 1973 Ramos et al. 3854892 December 1974 Burgess et al. 3911553 October 1975 Burgess et al. 3958075 May 1976 Kaufman 3993411 November 1976 Babcock et al. 3994430 November 1976 Cusano et al. 4129243 December 1978 Cusano et al. 4156148 May 1979 Kaufman 4196411 April 1980 Kaufman 4215235 July 1980 Kaufman 4218724 August 1980 Kaufman 4250481 February 1981 Kaufman 4266140 May 1981 Kaufman 4394530 July 1983 Kaufman 4449165 May 1984 Kaufman 4449292 May 1984 Kaufman 4488202 December 1984 Kaufman 4498120 February 1985 Kaufman 4546410 October 1985 Kaufman 4546411 October 1985 Kaufman 4554613 November 1985 Kaufman 4574162 March 1986 Kaufman 4577387 March 1986 Kaufman 4630174 December 1986 Kaufman 4700273 October 1987 Kaufman |
| Other References: | "Over 50 Years of Experience With the Direct Bond Copper Process", Tegmen Corp., 1201 East Fayette Street, Syracuse, N.Y. |
| Primary Examiner: | Arbes, Carl J. |
| Attorney, Agent or Firm: | Andrus, Sceales, Starke & Sawall |
| رقم الانضمام: | edspgr.04788765 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |