التفاصيل البيبلوغرافية
| العنوان: |
METHOD OF MANUFACTURING BLOCK MODULE |
| Document Number: |
20120084977 |
| تاريخ النشر: |
April 12, 2012 |
| Appl. No: |
13/268252 |
| Application Filed: |
October 07, 2011 |
| مستخلص: |
Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple. |
| Inventors: |
PARK, Seung Wook (Gyunggi-do, KR); KWEON, Young Do (Seoul, KR); HONG, Ju Pyo (Gyunggi-do, KR); SHIN, Seung Wan (Gyunggi-do, KR); OH, Kyung Seob (Gyunggi-do, KR) |
| Assignees: |
SAMSUNG ELECTRO-MECHANICS CO., LTD. (Gyunggi-do, KR) |
| Claim: |
1. A method of manufacturing a block module, comprising: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and disposing a metal coating layer connected to the lead frame on the mold. |
| Claim: |
2. The method as set forth in claim 1, wherein at the forming of the metal coating layer, the metal coating layer is disposed to surround the mold. |
| Claim: |
3. The method as set forth in claim 1, wherein at the forming of the lead frame, the lead frames each extend from the ground terminals formed at four corner directions of the base substrate. |
| Claim: |
4. The method as set forth in claim 1, wherein at the exposing to the outside, the cut surface of the lead frame is co-plane with the surface exposed to the outside of the mold. |
| Claim: |
5. The method as set forth in claim 1, wherein the electronic part is an active device, a passive device, or a package substrate. |
| Claim: |
6. The method as set forth in claim 1, wherein at the exposing to the outside, the cutting of the lead frame is made by a dicing process. |
| Claim: |
7. The method as set forth in claim 1, wherein at the exposing to the outside, the block module is divided into a unit block module by the dicing process. |
| Claim: |
8. The method as set forth in claim 1, wherein at the forming of the lead frame, the lead frame is bonded to the ground terminal, having a solder layer interposed between the lead frame and the ground terminal. |
| Claim: |
9. The method as set forth in claim 1, wherein at the mounting of the electronic part, the ground terminal is an align mark. |
| Claim: |
10. The method as set forth in claim 1, wherein at the exposing to the outside, the lead frame and the outside of the mold are cut together. |
| Current U.S. Class: |
29/832 |
| Current International Class: |
05 |
| رقم الانضمام: |
edspap.20120084977 |
| قاعدة البيانات: |
USPTO Patent Applications |