التفاصيل البيبلوغرافية
| العنوان: |
Package Substrate and Light Emitting Device Using the Same |
| Document Number: |
20100072492 |
| تاريخ النشر: |
March 25, 2010 |
| Appl. No: |
12/334476 |
| Application Filed: |
December 14, 2008 |
| مستخلص: |
A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure. |
| Inventors: |
CHEN, Chih-Ming (Hsin-Chu Hsein, TW); YANG, Cheng-Hung (Hsin-Chu Hsein, TW) |
| Claim: |
1. An improvement in a package substrate at least comprising: a metal substrate, on the surface of which an insulating layer is disposed, and the metal substrate is provided thereon with at least one trench that is recessed into the surface of the metal substrate through the insulating layer; and more than one light emitting dies, which are secured in the trench. |
| Claim: |
2. The improvement in a package substrate according to claim 1, wherein at least one wiring layer is disposed on the insulating layer close to the trench, and metal wires are disposed between the light emitting dies and the wiring layer to form the electrical connection between the light emitting dies and the wiring layer. |
| Claim: |
3. The improvement in a package substrate according to claim 2, wherein packaging glue covers all the light emitting dies and the metal wires, and the packaging glue is transparent glue or fluorescent glue. |
| Claim: |
4. The improvement in a package substrate according to claim 1, wherein all the light emitting dies are electrically connected in series or parallel. |
| Claim: |
5. The improvement in a package substrate according to claim 1, wherein the sides of the trench are formed as inclined wall surfaces. |
| Claim: |
6. The improvement in a package substrate according to claim 1, wherein a polished reflective layer is disposed on the surface of the trench. |
| Claim: |
7. The improvement in a package substrate according to claim 6, wherein insulating paste is provided between the light emitting dies and the polished reflective layer. |
| Claim: |
8. The improvement in a package substrate according to claim 1, wherein the electrodes on the bottoms of the light emitting dies are directly electrically connected to the trench in a non-insulating manner. |
| Claim: |
9. The improvement in a package substrate according to claim 8, wherein conductive paste is provided between the light emitting dies and the trench. |
| Claim: |
10. The improvement in a package substrate according to claim 8, wherein a polished reflective layer is disposed on the surface of the trench, and conductive paste is provided between the light emitting dies and the polished reflective layer. |
| Claim: |
11. A light emitting device using a package substrate at least comprising: a metal substrate, which is provided thereon with a plurality of trenches, an insulating layer being disposed on the surface of the metal substrate but different from that of the trenches, the trenches being recessed into the surface of the metal substrate through the insulating layer, and at least one wiring layer being disposed on the insulating layer close to the trenches; a plurality of light emitting dies, which are secured in the trenches, metal wires being disposed between the light emitting dies and the wiring layer; at least one enclosure, which is disposed on the surface of the metal substrate and encloses all the trenches; and packaging glue, which is provided in the enclosure and covers all the light emitting dies. |
| Claim: |
12. The light emitting device according to claim 11, wherein all the light emitting dies are electrically connected in series or parallel. |
| Claim: |
13. The light emitting device according to claim 11, wherein the sides of the trenches are formed as inclined wall surfaces. |
| Claim: |
14. The light emitting device according to claim 11, wherein the enclosure is formed as one piece with the metal substrate or not. |
| Claim: |
15. The light emitting device according to claim 11, wherein the plurality of trenches are connected in series or parallel by means of the wiring layer. |
| Claim: |
16. The light emitting device according to claim 11, wherein the packaging glue is transparent glue or fluorescent glue. |
| Claim: |
17. The light emitting device according to claim 11, wherein a polished reflective layer is disposed on the surface of the trench. |
| Claim: |
18. The light emitting device according to claim 17, wherein insulating paste is provided between the light emitting dies and the polished reflective layer. |
| Claim: |
19. The light emitting device according to claim 11, wherein the electrodes on the bottoms of the light emitting dies are directly electrically connected to the trenches in a non-insulating manner. |
| Claim: |
20. The light emitting device according to claim 19, wherein a polished reflective layer is disposed on the surface of the trench, and conductive paste is provided between the light emitting dies and the polished reflective layer. |
| Current U.S. Class: |
257/88 |
| Current International Class: |
01 |
| رقم الانضمام: |
edspap.20100072492 |
| قاعدة البيانات: |
USPTO Patent Applications |