التفاصيل البيبلوغرافية
| العنوان: |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| Document Number: |
20080185362 |
| تاريخ النشر: |
August 7, 2008 |
| Appl. No: |
12/059643 |
| Application Filed: |
March 31, 2008 |
| مستخلص: |
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer. |
| Inventors: |
NAKAJIMA, Kanako (Ryugasaki-shi, JP); INABA, Masatoshi (Abiko-shi, JP); UNAMI, Yoshiharu (Tomisato-shi, JP) |
| Assignees: |
FUJIKURA LTD. (Tokyo, JP) |
| Claim: |
1. A method of manufacturing a printed circuit board, comprising: forming a wiring layer, by patterning, on a first surface of a flexible insulated substrate; placing a reinforcement material on a second surface of the flexible insulated substrate via an auxiliary material; forming a pattern mask layer to partially expose a surface of the reinforcement material; and shaping an auxiliary layer and a reinforcement plate by etching the exposed surface. |
| Claim: |
2. The method of manufacturing a printed circuit board according to claim 1, wherein, the etching speed of the auxiliary material is faster than the reinforcement material. |
| Claim: |
3. A method of manufacturing a printed circuit board according to claim 1, wherein the auxiliary material is directly adhered to the flexible insulated substrate. |
| Claim: |
4. A method of manufacturing a printed circuit board according to claim 1 wherein the flexible insulated substrate and reinforcement material are bonded each other. |
| Claim: |
5. A method of manufacturing a printed circuit board according to claim 1 wherein the flexible insulated substrate and reinforcement material are bonded each other. |
| Claim: |
6. A method of manufacturing a printed circuit board according to claim 3 wherein the auxiliary material is adhered to the flexible insulated substrate by thermo-compression bonding. |
| Claim: |
7. A method of manufacturing a printed circuit board according to claim 4 wherein the flexible insulated substrate and the reinforcement material are bonded together by thermo-compression bonding. |
| Claim: |
8. A method of manufacturing a printed circuit board according to claim 5 wherein the flexible insulated substrate and the reinforcement material are bonded together by thermo-compression bonding. |
| Current U.S. Class: |
216/20 |
| Current International Class: |
01 |
| رقم الانضمام: |
edspap.20080185362 |
| قاعدة البيانات: |
USPTO Patent Applications |