التفاصيل البيبلوغرافية
| العنوان: |
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD |
| Document Number: |
20080146123 |
| تاريخ النشر: |
June 19, 2008 |
| Appl. No: |
11/950496 |
| Application Filed: |
December 05, 2007 |
| مستخلص: |
A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring. |
| Inventors: |
TORII, Koji (Chuo-ku, JP) |
| Assignees: |
ELPIDA MEMORY, INC. (Chuo-ku, JP) |
| Claim: |
1. A semiconductor device manufacturing apparatus comprising a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and a polishing pad for polishing a polished surface of the semiconductor wafer, the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer against said polishing pad together with said retainer ring to polish the semiconductor wafer, wherein: said retainer ring has a shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
2. The semiconductor device manufacturing apparatus according to claim 1, wherein said shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring comprises a plurality of grooves or holes which differ in depth in the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
3. The semiconductor device manufacturing apparatus according to claim 1, wherein said shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring comprises a plurality of grooves or holes each having a tapered or a curved surface in the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
4. The semiconductor device manufacturing apparatus according to claim 1, wherein said shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring comprises a tapered or a convexly curved surface on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
5. The semiconductor device manufacturing apparatus according to claim 1, wherein said shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring comprises multiple steps on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
6. The semiconductor device manufacturing apparatus according to claim 1, wherein said shape for increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring comprises a material which differs in physical properties from the remaining area in an outer peripheral area of the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
7. A semiconductor device manufacturing method using a polishing apparatus comprising a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and a polishing pad for polishing a polished surface of the semiconductor wafer, the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer onto said polishing pad together with said retainer ring to polish the semiconductor wafer, said method comprising: adjusting an effective pressure of said retainer ring by increasing the contact area of said retainer ring with respect to said polishing pad in accordance with wear that occurs on said retainer ring. |
| Claim: |
8. The semiconductor device manufacturing method according to claim 7, comprising: providing said retainer ring having a plurality of grooves or holes which differ in depth in the surface of said retainer ring that is in contact with said polishing pad, increasing the contact area of said retainer ring with respect to said polishing pad by eliminating step by step a plurality of said grooves or holes, which differ in depth, formed in the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
9. The semiconductor device manufacturing method according to claim 7, comprising: providing said retainer ring having a plurality of grooves or holes each having a tapered or a curved surface, formed in the surface of said retainer ring that is in contact with said polishing pad, increasing the contact area of said retainer ring with respect to said polishing pad by reducing step by step a plurality of said grooves or holes each having a tapered or a curved surface formed in the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
10. The semiconductor device manufacturing method according to claim 7, comprising: providing said retainer ring having a tapered or a curved surface formed on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad, increasing the contact area of said retainer ring with respect to said polishing pad by spreading a width of said retainer ring in association with a step-by-step reduction of the tapered or a convexly curved surface formed on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
11. The semiconductor device manufacturing method according to claim 7, comprising: providing said retainer ring having multiple steps formed on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad, increasing the contact area of said retainer ring with respect to said polishing pad by spreading a width of said retainer ring in association with a step-by-step reduction of the multiple steps formed on an outer peripheral edge of the surface of said retainer ring that is in contact with said polishing pad. |
| Claim: |
12. The semiconductor device manufacturing method according to claim 7, comprising: providing said retainer ring having an outer peripheral area of the surface of said retainer ring that is in contact with said polishing pad made of a material which differs in physical properties from the remaining area, increasing the contact area of said retainer ring with respect to said polishing pad, by spreading a width of the surface of said retainer ring that is in contact with said polishing pad, in association with a step-by-step reduction of the material which differs in physical properties from the remaining area and which is formed in the outer peripheral area of the surface of said retainer ring that is in contact with said polishing pad. |
| Current U.S. Class: |
451/64 |
| Current International Class: |
24 |
| رقم الانضمام: |
edspap.20080146123 |
| قاعدة البيانات: |
USPTO Patent Applications |