التفاصيل البيبلوغرافية
| العنوان: |
Thermally conductive composite and uses for microelectronic packaging |
| Document Number: |
20080007890 |
| تاريخ النشر: |
January 10, 2008 |
| Appl. No: |
11/239712 |
| Application Filed: |
September 29, 2005 |
| مستخلص: |
The present invention provides thermally conductive, electrically insulating composites that can be used to help conduct heat away from a heat source such as from microelectronic structures that generate heat during use. In one aspect, the present invention relates to an electronic system comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device. The composite is derived from ingredients comprising a macrocyclic oligomer; and a thermally conductive filler. |
| Inventors: |
Harmon, Julianne P. (Tampa, FL, US); Heffner, Kenneth H. (Largo, FL, US); Fleischman, Scott G. (Palmetto, FL, US); Dalzell, William J. (Parrish, FL, US) |
| Claim: |
1. A thermally conductive composite, said composite being derived from ingredients comprising a. a macrocyclic oligomer; and b. a thermally conductive filler. |
| Claim: |
2. The thermally conductive composite of claim 1, wherein the macrocyclic oligomer comprises a plurality of polyester linkages. |
| Claim: |
3. The thermally conductive composite of claim 1, wherein the macrocyclic oligomer is thermoplastic. |
| Claim: |
4. The thermally conductive composite of claim 1, wherein the composite comprises a polyester polymer derived from one or more constituents comprising the macrocyclic oligomer. |
| Claim: |
5. The thermally conductive composite of claim 4, wherein said polyester polymer is thermoplastic. |
| Claim: |
6. The thermally conductive composite of claim 1, wherein the macrocyclic oligomer comprises a cyclic moiety comprising an alkylene terephthalate. |
| Claim: |
7. The thermally conductive composite of claim 6, wherein said alkylene terephthalate comprises butylene terephthalate. |
| Claim: |
8. The thermally conductive composite of claim 1, wherein the filler comprises a nanotube, a nitride, or a combination of these. |
| Claim: |
9. The thermally conductive composite of claim 1, wherein the filler has an average particle size in the longest dimension in the range of 1 micrometer to about 30 micrometers. |
| Claim: |
10. The thermally conductive composite of claim 1, wherein the filler has an average particle size in the longest dimension in the range of 10 micrometer to about 80 micrometers. |
| Claim: |
11. The thermally conductive composite of claim 1, wherein the filler has an average particle size in the longest dimension in the range of 20 micrometer to about 40 micrometers. |
| Claim: |
12. The thermally conductive composite of claim 1, wherein the composite comprises 0.5 to 60 volume percent of the filler. |
| Claim: |
13. The thermally conductive composite of claim 1, wherein the filler has a volume resistivity of at least about 1×103 ohms. |
| Claim: |
14. The thermally conductive composite of claim 1, wherein the filler has a thermal conductivity of at least about 2 W/m*K. |
| Claim: |
15. The thermally conductive composite of claim 1, wherein the filler has a thermal conductivity of at least about 3 W/m*K. |
| Claim: |
16. A method of making a thermally conductive composite, comprising the step of incorporating a thermally conductive filler into a matrix derived from ingredients comprising a macrocyclic oligomer. |
| Claim: |
17. The method of claim 16, wherein said incorporating step comprises physically blending the filler and the oligomer. |
| Claim: |
18. The method of claim 16, wherein said incorporating step comprises melting the oligomer and blending the filler into the melted oligomer. |
| Claim: |
19. The method of claim 16, further comprising the step of heating the composite under conditions effective to polymerize the oligomer. |
| Claim: |
20. The method of claim 16, wherein the macrocyclic oligomer comprises a plurality of polyester linkages. |
| Claim: |
21. The method of claim 16, wherein the macrocyclic oligomer is thermoplastic. |
| Claim: |
22. The method of claim 16, wherein the composite comprises a polyester polymer derived from one or more constituents comprising the macrocyclic oligomer. |
| Claim: |
23. The method of claim 22, wherein said polyester polymer is thermoplastic. |
| Claim: |
24. The method of claim 16, wherein the macrocyclic oligomer comprises a cyclic moiety comprising an alkylene terephthalate. |
| Claim: |
25. The method of claim 24, wherein said alkylene terephthalate comprises butylene terephthalate. |
| Claim: |
26. The method of claim 16, wherein the filler comprises a nanotube, a nitride, or a combination of these. |
| Claim: |
27. The method of claim 16, wherein the filler has an average particle size in the longest dimension in the range of 1 micrometer to about 30 micrometers. |
| Claim: |
28. The method of claim 16, wherein the filler has an average particle size in the longest dimension in the range of 10 micrometer to about 80 micrometers. |
| Claim: |
29. The method of claim 16, wherein the filler has an average particle size in the longest dimension in the range of 20 micrometer to about 40 micrometers. |
| Claim: |
30. The method of claim 16, wherein the composite comprises 0.5 to 60 volume percent of the filler. |
| Claim: |
31. The method of claim 16, wherein the filler has a volume resistivity of at least about 1×103 ohms. |
| Claim: |
32. The method of claim 16, wherein the filler has a thermal conductivity of at least about 2 W/m*K. |
| Claim: |
33. The method of claim 16, wherein the filler has a thermal conductivity of at least about 3 W/m*K. |
| Claim: |
34. An electronic system, comprising: a) a microelectronic device or power supply component(s); b) a thermally conductive, composite in thermal contact with the microelectronic device or power supply component(s), said composite being derived from ingredients comprising i. a macrocyclic oligomer; and ii. a thermally conductive filler. |
| Claim: |
35. The system of claim 34, wherein the electronic system constitutes a portion of a spacecraft, a missile, an interceptor, a launch vehicle, and an aircraft. |
| Claim: |
36. The system of claim 34, wherein the composite encapsulates at least a portion of the microelectronic device or power supply component(s). |
| Claim: |
37. The system of claim 34, wherein the macrocyclic oligomer comprises a cyclic moiety comprising an alkylene terephthalate. |
| Claim: |
38. The system of claim 37, wherein said alkylene terephthalate comprises butylene terephthalate. |
| Claim: |
39. The system of claim 34, wherein the filler comprises boron nitride. |
| Claim: |
40. The system of claim 34, wherein the filler is substantially non-acicular. |
| Claim: |
41. The system of claim 34, wherein the filler has an average particle size in the longest dimension in the range of 1 micrometer to about 30 micrometers. |
| Claim: |
42. The system of claim 34, wherein the composite comprises 0.5 to 60 volume percent of the filler. |
| Claim: |
43. A spacecraft comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device, said composite being derived from ingredients comprising: a) a macrocyclic oligomer; and b) a thermally conductive filler. |
| Claim: |
44. An electronic system, comprising a) a heat source comprising a microelectronic device; b) a heat-dissipating radiator; and c) a thermal pathway interconnecting the heat source and the radiator, said pathway comprising a thermally conductive, composite comprising i. a macrocyclic oligomer; and ii. a thermally conductive filler. |
| Claim: |
45. A method of making a microelectronic device, comprising the step of encapsulating at least a portion of the device with a thermally conductive, composite, said coating being derived from ingredients comprising a macrocyclic oligomer and a thermally conductive filler. |
| Claim: |
46. The method of claim 45, wherein said encapsulating step comprises the steps of: a) placing a pre-form sheet over the device, wherein the sheet comprises the oligomer and the filler; b) thermally fluidizing the oligomer in the sheet to form a fluidic composite whereby the fluidic composite coats at least a portion of the device; c) causing the oligomer to polymerize, whereby the composite solidifies and encapsulates at least a portion of the device. |
| Claim: |
47. The method of claim 45, wherein said encapsulating step comprises the steps of: a) spraying a fluid composite composition onto at least a portion of the device, said composite composition comprising the oligomer and the filler; and b) causing the sprayed composition to form a solid encapsulant over at least a portion of the device. |
| Claim: |
48. The method of claim 45, wherein said encapsulating step comprises the steps of: a) coating a paste onto at least a portion of the device, said paste comprising the oligomer and the filler; and b) causing the paste to form a solid encapsulant over at least a portion of the device. |
| Current U.S. Class: |
361321/500 |
| Current International Class: |
01 |
| رقم الانضمام: |
edspap.20080007890 |
| قاعدة البيانات: |
USPTO Patent Applications |