GROUP-III NITRIDE VERTICAL-RODS SUBSTRATE

التفاصيل البيبلوغرافية
العنوان: GROUP-III NITRIDE VERTICAL-RODS SUBSTRATE
Document Number: 20070272914
تاريخ النشر: November 29, 2007
Appl. No: 11/552527
Application Filed: October 25, 2006
مستخلص: The invention is directed to a group-III nitride vertical-rods substrate. The group-III vertical-rods substrate comprises a substrate, a buffer layer and a vertical rod layer. The buffer layer is located over the substrate. The vertical rod layer is located on the buffer layer and the vertical rod layer is comprised of a plurality of vertical rods standing on the buffer layer.
Inventors: Lai, Chih-Ming (Pingtung County, TW); Liu, Wen-Yueh (Taipei City, TW); Tsay, Jenq-Dar (Kaohsiung City, TW); Hsu, Jung-Tsung (Hsinchu City, TW); Gwo, Shang-Jr (Hsinchu City, TW); Shen, Chang-Hong (Yilan County, TW); Lin, Hon-Way (Taipei City, TW)
Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, TW), NATIONAL TSING HUA UNIVERSITY (Hsinchu, TW)
Claim: 1. A group-III nitride vertical-rods substrate, comprising: a substrate; a buffer layer located over the substrate; and a vertical rod layer located on the buffer layer, wherein the vertical rod layer is comprised of a plurality of vertical rods standing on the buffer layer.
Claim: 2. The group-III nitride vertical-rods substrate of claim 1, wherein the material of each of the vertical rod includes group-III nitride.
Claim: 3. The group-III nitride vertical-rods substrate of claim 1, wherein the material of each of the vertical rod includes gallium nitride.
Claim: 4. The group-III nitride vertical-rods substrate of claim 1, wherein the buffer layer is a complex layer.
Claim: 5. The group-III nitride vertical-rods substrate of claim 4, wherein the complex layer includes a silicon nitride/group-III nitride layer.
Claim: 6. The group-III nitride vertical-rods substrate of claim 4, wherein the thickness of the buffer layer is about 1˜60 nano meters.
Claim: 7. The group-III nitride vertical-rods substrate of claim 1, wherein the material of the buffer layer includes silicon nitride.
Claim: 8. The group-III nitride vertical-rods substrate of claim 7, wherein the thickness of the buffer layer is less than 10 nano meters.
Claim: 9. The group-III nitride vertical-rods substrate of claim 1, wherein a diameter of a cross-section of each of the vertical rods is about 60˜150 nano meters.
Claim: 10. The group-III nitride vertical-rods substrate of claim 1 further comprising a group-III nitride layer located on the vertical rod layer.
Claim: 11. The group-III nitride vertical-rods substrate of claim 1, wherein the thickness of the vertical rod layer is about 10 nano meters˜5 micro meters.
Claim: 12. The group-III nitride vertical-rods substrate of claim 1, wherein the distribution density of the vertical rods of the vertical rod layer over the substrate is about 109/cm2˜1012/cm2.
Claim: 13. A group-III nitride vertical-rods substrate, comprising: a substrate; a vertical rod layer on the substrate, wherein the vertical rod layer is comprised of a plurality of monomorphism vertical rods; and a group III nitride semiconductor layer on the vertical rod layer.
Claim: 14. The group-III nitride vertical-rods substrate of claim 13 further comprising a silicon nitride buffer layer located between the substrate and the vertical rod layer.
Claim: 15. The group-III nitride vertical-rods substrate of claim 14, wherein the thickness of the silicon nitride layer is less than 10 nano meters.
Claim: 16. The group-III nitride vertical-rods substrate of claim 14, wherein a sub-buffer layer is located between the silicon nitride buffer layer and the vertical rod layer.
Claim: 17. The group-III nitride vertical-rods substrate of claim 16, wherein the thickness of the sub-buffer layer is about 1˜50 nano meters.
Claim: 18. The group-III nitride vertical-rods substrate of claim 16, wherein the material of the sub-buffer layer includes group-III nitride.
Claim: 19. The group-III nitride vertical-rods substrate of claim 13, wherein the material of each of the vertical rod includes group-III nitride.
Claim: 20. The group-III nitride vertical-rods substrate of claim 13, wherein the material of each of the vertical rods includes gallium nitride.
Claim: 21. The group-III nitride vertical-rods substrate of claim 13, wherein the thickness of the vertical rod layer is about 10 nano meters˜5 micro meters.
Claim: 22. The group-III nitride vertical-rods substrate of claim 13, wherein the distribution density of the vertical rods of the vertical rod layer over the substrate is about 109/cm2˜1012/cm2.
Claim: 23. The group-III nitride vertical-rods substrate of claim 13, wherein a diameter of a cross-section of each of the vertical rods is about 60˜150 nano meters.
Current U.S. Class: 257/9
Current International Class: 01
رقم الانضمام: edspap.20070272914
قاعدة البيانات: USPTO Patent Applications