Heat Pipe heat sink

التفاصيل البيبلوغرافية
العنوان: Heat Pipe heat sink
Document Number: 20070187069
تاريخ النشر: August 16, 2007
Appl. No: 11/654690
Application Filed: January 18, 2007
مستخلص: A heat sink (1), has heat pipes (3) which are disposed in a high temperature section (A) of a base plate (2) on which a heating element (4) is disposed so that the heat pipes (3) extend from the high temperature section (A) to low temperature sections (B) in different directions.
Inventors: Ueno, Seizo (Tokyo, JP); Eda, Yoshiya (Tokyo, JP); Nagamatsu, Shinya (Tokyo, JP)
Assignees: FURUKAWA-SKY ALUMINUM CORP. (TOKYO, JP)
Claim: 1. A heat sink, characterized in that heat pipes are disposed in a high temperature section of a base plate on which a heating element is disposed so that the heat pipes extend from the high temperature section to low temperature sections in different directions.
Claim: 2. The heat sink according to claim 1, characterized in that the heat pipes are disposed in proximity to each other in the high temperature section so as to be in parallel and/or overlap with each other.
Claim: 3. The heat sink according to claim 1, characterized in that the heat pipes are disposed so as to extend radially from the high temperature section to the low temperature sections.
Claim: 4. The heat sink according to claim 1, characterized in that the number of heat pipes disposed so as to extend from the high temperature section to the low temperature sections on a leeward side exceeds the number of heat pipes disposed so as to extend from the high temperature section to the low temperature sections on a windward side.
Claim: 5. The heat sink according to claim 1, characterized in that the base plate includes an extruded material having a plurality of holes, in which the heat pipes varied in lengths and positions for the respective holes are disposed.
Claim: 6. The heat sink according to claim 1, characterized in that the heat sink is used in railroad vehicles or automobiles.
Current U.S. Class: 165080/300
Current International Class: 05
رقم الانضمام: edspap.20070187069
قاعدة البيانات: USPTO Patent Applications