Electronic Resource
Carbon Dot Emission Enhancement in Covalent Complexes with Plasmonic Metal Nanoparticles
العنوان: | Carbon Dot Emission Enhancement in Covalent Complexes with Plasmonic Metal Nanoparticles |
---|---|
المؤلفون: | Arefina, Irina A., Kurshanov, Danil A., Vedernikova, Anna A., Danilov, Denis V., Koroleva, Aleksandra V., Zhizhin, Evgeniy V., Sergeev, Aleksandr A., Fedorov, Anatoly V., Ushakova, Elena V., Rogach, Andrey L. |
بيانات النشر: | MDPI 2023 |
نوع الوثيقة: | Electronic Resource |
مستخلص: | Carbon dots can be used for the fabrication of colloidal multi-purpose complexes for sensing and bio-visualization due to their easy and scalable synthesis, control of their spectral responses over a wide spectral range, and possibility of surface functionalization to meet the application task. Here, we developed a chemical protocol of colloidal complex formation via covalent bonding between carbon dots and plasmonic metal nanoparticles in order to influence and improve their fluorescence. We demonstrate how interactions between carbon dots and metal nanoparticles in the formed complexes, and thus their optical responses, depend on the type of bonds between particles, the architecture of the complexes, and the degree of overlapping of absorption and emission of carbon dots with the plasmon resonance of metals. For the most optimized architecture, emission enhancement reaching up to 5.4- and 4.9-fold for complexes with silver and gold nanoparticles has been achieved, respectively. Our study expands the toolkit of functional materials based on carbon dots for applications in photonics and biomedicine to photonics. © 2023 by the authors. |
مصطلحات الفهرس: | Carbodiimide chemistry, Carbon dots, Emission enhancement, Metal nanoparticles, Plasmonic resonance, Article |
URL: | |
الاتاحة: | Open access content. Open access content |
ملاحظة: | English |
Other Numbers: | HNK oai:repository.hkust.edu.hk:1783.1-124423 Nanomaterials, v. 13, (2), January 2023, article number 223 2079-4991 1376638095 |
المصدر المساهم: | HONG KONG UNIV OF SCI & TECH, THE From OAIster®, provided by the OCLC Cooperative. |
رقم الانضمام: | edsoai.on1376638095 |
قاعدة البيانات: | OAIster |
الوصف غير متاح. |