Electronic Resource
Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding
| العنوان: | Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding |
|---|---|
| المؤلفون: | Quellmalz, Arne, Sawallich, S., Prechtl, M., Hartwig, O., Luo, S., Wagner, S., Duesberg, G. S., Lemme, M. C., Niklaus, Frank, Gylfason, Kristinn |
| بيانات النشر: | KTH, Mikro- och nanosystemteknik Institute of Electrical and Electronics Engineers Inc. 2021 |
| نوع الوثيقة: | Electronic Resource |
| مستخلص: | The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS2). Part of proceedings: ISBN 978-1-943580-91-0Not duplicate with DiVA 1665889QC 20230206 |
| مصطلحات الفهرس: | Layered semiconductors, Optical fibers, Sulfur compounds, Wafer bonding, High volume manufacturing, Photonic application, Semiconductor equipment, Stackings, Two-dimensional materials, Molybdenum compounds, Atom and Molecular Physics and Optics, Atom- och molekylfysik och optik, Other Materials Engineering, Annan materialteknik, Conference paper, info:eu-repo/semantics/conferenceObject, text |
| URL: | 2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings |
| الاتاحة: | Open access content. Open access content info:eu-repo/semantics/restrictedAccess |
| ملاحظة: | English |
| Other Numbers: | UPE oai:DiVA.org:kth-313857 0000-0003-3936-818x 0000-0002-0525-8647 0000-0001-9008-8402 ISI:000831479800049 Scopus 2-s2.0-85120456618 1372251237 |
| المصدر المساهم: | UPPSALA UNIV LIBR From OAIster®, provided by the OCLC Cooperative. |
| رقم الانضمام: | edsoai.on1372251237 |
| قاعدة البيانات: | OAIster |
| الوصف غير متاح. |