Electronic Resource
Overlayer Adhesion and Passivation of Electronic Materials
| العنوان: | Overlayer Adhesion and Passivation of Electronic Materials |
|---|---|
| المؤلفون: | MAINE UNIV AT ORONO LAB FOR SURFACE SCIENCE AND TECHNOLOGY, Unertl, W. N., Grunze, M., Frankel, D. |
| المصدر: | DTIC AND NTIS |
| بيانات النشر: | 1992-07-16 |
| نوع الوثيقة: | Electronic Resource |
| مصطلحات الفهرس: | Polymer Chemistry, Plastics, Solvents, Cleaners, and Abrasives, ELECTRONICS, MATERIALS, ADHESION, METALS, THIN FILMS, SURFACES, FABRICATION, COMPOSITE MATERIALS, POLYMERS, INTERFACES, OVERLAYERS, PASSIVATION, POLYIMIDES, LANGMUIR BLODGETT TECHNIQUES., Text |
| URL: | |
| الاتاحة: | Open access content. Open access content Approved for public release; distribution is unlimited. |
| ملاحظة: | text/html English |
| Other Numbers: | DTICE ADA254783 832011911 |
| المصدر المساهم: | From OAIster®, provided by the OCLC Cooperative. |
| رقم الانضمام: | edsoai.ocn832011911 |
| قاعدة البيانات: | OAIster |
| الوصف غير متاح. |