Dissertation/ Thesis
The Improvement of Yield in Flip Chip Package by Using Response Surface Method of Laser Ablation and Drilling Structure
| العنوان: | The Improvement of Yield in Flip Chip Package by Using Response Surface Method of Laser Ablation and Drilling Structure |
|---|---|
| Alternate Title: | 雷射鑽孔反應曲面法與鑽孔型式於改善封裝製程良率之研究 |
| المؤلفون: | CHAO, YU-HSIANG, 趙昱翔 |
| Thesis Advisors: | SHIH, MING-CHANG, 施明昌 |
| سنة النشر: | 2016 |
| المجموعة: | National Digital Library of Theses and Dissertations in Taiwan |
| الوصف: | 104 Flip Chip packaging has become the main structure of high-performance IC packaging. While IC functions upgrade, package size become thinner and lighter, stacked package; so called package on package (POP) has become another new packaging concept. In POP packaging, laser drilling become the key technology for drilling scarified compound surrounded solder ball. However, accuracy and depth control of laser drilling are major factors on the yield of the POP process. Therefore, this study we applied the method of response surface to analyze the effect of laser drilling parameters, such as laser power, pulse frequency, and drilling speed to the shape of drilled hole, and to achieve the optimized laser drilling, to meet the requirements of POP package. |
| Original Identifier: | 104NUK01442010 |
| نوع الوثيقة: | 學位論文 ; thesis |
| وصف الملف: | 58 |
| الاتاحة: | http://ndltd.ncl.edu.tw/handle/33599396319335368657 |
| رقم الانضمام: | edsndl.TW.104NUK01442010 |
| قاعدة البيانات: | Networked Digital Library of Theses & Dissertations |
| الوصف غير متاح. |