Dissertation/ Thesis
Investigation of Interfacial Stresses, Warpage and Vibration Behavior of Bonded Structures
| العنوان: | Investigation of Interfacial Stresses, Warpage and Vibration Behavior of Bonded Structures |
|---|---|
| Alternate Title: | 黏接結構介面應力、翹曲變形及振動行為之探討 |
| المؤلفون: | Jiong-shiun Hsu, 徐炯勛 |
| Thesis Advisors: | Wei-Chung Wang, 王偉中 |
| سنة النشر: | 2003 |
| المجموعة: | National Digital Library of Theses and Dissertations in Taiwan |
| الوصف: | 92 In this study, the digital photoelasticity and finite element method (FEM) were first combined to show the respective shortcomings of Timoshenko’s, Suhir’s 1986 and Suhir’s 1989 theories on bonded structures. To remedy those theories and meet the requirement of ease to implement in engineering applications, an improved theory was then developed to accurately predict the distributions of interfacial peeling and shearing stresses for bonded structures subjected to thermal loading. The theory was further extended to estimate the distributions of interfacial stresses of bonded structures under mechanical loading. The influence of voids and embedded inclusions on the stress distribution in the adherends and interfacial stresses were also discussed. The moiré interferometry and FEM were also incorporated to verify the predicted accuracy of warpage for different analytical solutions. Finally, AF-ESPI and modal testing technique were employed to investigate the vibration behavior of bonded structures. |
| Original Identifier: | 092NTHU0311001 |
| نوع الوثيقة: | 學位論文 ; thesis |
| وصف الملف: | 205 |
| الاتاحة: | http://ndltd.ncl.edu.tw/handle/36730370425293369751 |
| رقم الانضمام: | edsndl.TW.092NTHU0311001 |
| قاعدة البيانات: | Networked Digital Library of Theses & Dissertations |
| الوصف غير متاح. |