Academic Journal
Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication
| العنوان: | Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication |
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| المؤلفون: | Isao Nishimura, Masahiro Kaneko, Takashi Doi, Tsutomu Shimokawa |
| المصدر: | Journal of Photopolymer Science and Technology. 2022, 35(4):313 |
| قاعدة البيانات: | J-STAGE |
| تدمد: | 09149244 13496336 |
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| DOI: | 10.2494/photopolymer.35.313 |