Academic Journal
Self-folding Method of Electronic Substrate using Hinges with Kirigami Structure
| العنوان: | Self-folding Method of Electronic Substrate using Hinges with Kirigami Structure / 切り紙構造ヒンジを用いた電子基板の自己折り畳み手法の提案 |
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| المؤلفون: | Atsushi EDA, Eiji IWASE, 岩瀬 英治, 江田 篤史 |
| المصدر: | The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec). 2019, :1-A05 |
| قاعدة البيانات: | J-STAGE |
| تدمد: | 24243124 |
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| DOI: | 10.1299/jsmermd.2019.1P2-A05 |