Academic Journal
Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder
| العنوان: | Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder |
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| المؤلفون: | Hyun Chul PARK, Kaoru KOBAYASHI, Kwang Soo KIM, Masao SAKANE, Tae Wuk WOO |
| المصدر: | Journal of Solid Mechanics and Materials Engineering. 2010, 4(9):1410 |
| قاعدة البيانات: | J-STAGE |
| تدمد: | 18809871 |
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| DOI: | 10.1299/jmmp.4.1410 |