Academic Journal
The Effect on the Mechanical Properties of P Addition and Bi Content to Sn-Ag-In-Bi Solders and on Their Joint Strength with Cu
| العنوان: | The Effect on the Mechanical Properties of P Addition and Bi Content to Sn-Ag-In-Bi Solders and on Their Joint Strength with Cu |
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| المؤلفون: | Michihiro TAGAMI, Mikio SUGAI, Ryuuji NINOMIYA, Shin-ichi NAKATA, Yuunosuke NAKAHARA |
| المصدر: | Journal of The Japan Institute of Electronics Packaging. 2002, 5(3):257 |
| قاعدة البيانات: | J-STAGE |
| تدمد: | 13439677 1884121X |
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| DOI: | 10.5104/jiep.5.257 |