Academic Journal
Cooperation between The Japan Institute of Electronics Packaging and The Japan Society of Applied Physics
| العنوان: | Cooperation between The Japan Institute of Electronics Packaging and The Japan Society of Applied Physics / エレクトロニクス実装学会と応用物理学会の連携に向けて |
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| المؤلفون: | Shigeaki Zaima, 財満 鎭明 |
| المصدر: | エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2020, 23(1):1 |
| قاعدة البيانات: | J-STAGE |
| تدمد: | 13439677 1884121X |
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| DOI: | 10.5104/jiep.23.P1 |