Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

التفاصيل البيبلوغرافية
العنوان:	Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
المؤلفون:	Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Jiang, Zhaoqi, Liu, Cong, Ma, Peng, Cheng, Dayong, Liu, Xin
المصدر:	Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 2, pp. 95-105.
URL الوصول:	http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2022-0028
قاعدة البيانات:	Emerald Insight

الوصف
تدمد:	09540911
DOI:	10.1108/SSMT-04-2022-0028