Academic Journal
High frequency modelling approach of on‐chip interconnects considering conductor and substrate skin effects
| العنوان: | High frequency modelling approach of on‐chip interconnects considering conductor and substrate skin effects |
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| المؤلفون: | Ymeri, H., Nauwelaers, B., Maex, K. |
| المصدر: | Microelectronics International: An International Journal, 2004, Vol. 21, Issue 1, pp. 35-38. |
| URL الوصول: | http://www.emeraldinsight.com/doi/10.1108/13565360410517111 |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 13565362 |
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| DOI: | 10.1108/13565360410517111 |