Academic Journal

A comprehensive review of radiation effects on solder alloys and solder joints

التفاصيل البيبلوغرافية
العنوان: A comprehensive review of radiation effects on solder alloys and solder joints
المؤلفون: Norliza Ismail, Wan Yusmawati Wan Yusoff, Nor Azlian Abdul Manaf, Azuraida Amat, Nurazlin Ahmad, Emee Marina Salleh
المصدر: Defence Technology, Vol 39, Iss , Pp 86-102 (2024)
بيانات النشر: KeAi Communications Co., Ltd., 2024.
سنة النشر: 2024
المجموعة: LCC:Military Science
مصطلحات موضوعية: Defence technology, Solder alloy, Solder joints, Radiation-induced effect, Microstructure, Mechanical properties, Military Science
الوصف: In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth, micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness, strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiation-resistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2214-9147
Relation: http://www.sciencedirect.com/science/article/pii/S2214914724000394; https://doaj.org/toc/2214-9147
DOI: 10.1016/j.dt.2024.02.007
URL الوصول: https://doaj.org/article/cfef1253c1ce41e8a5be61dbc6dde1d7
رقم الانضمام: edsdoj.fef1253c1ce41e8a5be61dbc6dde1d7
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:22149147
DOI:10.1016/j.dt.2024.02.007