Academic Journal

Copper micromesh-based lightweight transparent conductor with short response time for wearable heaters

التفاصيل البيبلوغرافية
العنوان: Copper micromesh-based lightweight transparent conductor with short response time for wearable heaters
المؤلفون: Han-Jung Kim, Yoonkap Kim
المصدر: Micro and Nano Systems Letters, Vol 9, Iss 1, Pp 1-10 (2021)
بيانات النشر: SpringerOpen, 2021.
سنة النشر: 2021
المجموعة: LCC:Technology
مصطلحات موضوعية: Wearable transparent heater, Transparent conductor, Metal mesh, Thermal response time, Transfer printing, Technology
الوصف: Abstract Thickness-controlled transparent conducting films (TCFs) were fabricated by transfer printing a 100 nm thick Cu micromesh structure onto poly(vinyl alcohol) (PVA) substrates of different thicknesses (~ 50, ~ 80, and ~ 120 μm) to develop a lightweight transparent wearable heater with short response time. The Cu mesh-based TCF fabricated on a ~ 50 µm thick PVA substrate exhibited excellent optical and electrical properties with a light transmittance of 86.7% at 550 nm, sheet resistance of ~ 10.8 Ω/sq, and figure-of-merit of approximately 236, which are comparable to commercial indium tin oxide film-based transparent conductors. The remarkable flexibility of the Cu mesh-based TCF was demonstrated through cyclic mechanical bending tests. In addition, the Cu mesh-based TCF with ~ 50 μm thick PVA substrate demonstrated a fast Joule heating performance with a thermal response time of ~ 18.0 s and a ramping rate of ~ 3.0 ℃/s under a driving voltage of 2.5 V. Lastly, the reliable response and recovery characteristics of the Cu mesh/PVA film-based transparent heater were confirmed through the cyclic power test. We believe that the results of this study is useful in the development of flexible transparent heaters, including lightweight deicing/defogging films, wearable sensors/actuators, and medical thermotherapy pads.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2213-9621
Relation: https://doaj.org/toc/2213-9621
DOI: 10.1186/s40486-021-00132-5
URL الوصول: https://doaj.org/article/c9e7cc8e95e54fdc9b3fd62b356de75b
رقم الانضمام: edsdoj.9e7cc8e95e54fdc9b3fd62b356de75b
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:22139621
DOI:10.1186/s40486-021-00132-5