التفاصيل البيبلوغرافية
العنوان: |
400 °C Sensor Based on Ni/4H-SiC Schottky Diode for Reliable Temperature Monitoring in Industrial Environments |
المؤلفون: |
Florin Draghici, Gheorghe Brezeanu, Gheorghe Pristavu, Razvan Pascu, Marian Badila, Adriana Pribeanu, Emilian Ceuca |
المصدر: |
Sensors, Vol 19, Iss 10, p 2384 (2019) |
بيانات النشر: |
MDPI AG, 2019. |
سنة النشر: |
2019 |
المجموعة: |
LCC:Chemical technology |
مصطلحات موضوعية: |
high-temperature sensor, read-out circuit, silicon carbide, Schottky diode, harsh environment, industrial temperature monitoring, Chemical technology, TP1-1185 |
الوصف: |
This paper presents a high-temperature probe suitable for operating in harsh industrial applications as a reliable alternative to low-lifespan conventional solutions, such as thermocouples. The temperature sensing element is a Schottky diode fabricated on 4H-SiC wafers, with Ni as the Schottky metal, which allows operation at temperatures up to 400 °C, with sensitivities over 2 mV/°C and excellent linearity (R2 > 99.99%). The temperature probe also includes dedicated circuitry for signal acquisition and conversion to the 4 mA−20 mA industrial standard output signal. This read-out circuit can be calibrated for linear response over a tunable temperature detection range. The entire system is designed for full electrical and mechanical compatibility with existing conventional probe casings, allowing for seamless implementation in a factory’s sensor network. Such sensors are tested alongside standard thermocouples, with matching temperature monitoring results, over several months, in real working conditions (a cement factory), up to 400 °C. |
نوع الوثيقة: |
article |
وصف الملف: |
electronic resource |
اللغة: |
English |
تدمد: |
1424-8220 |
Relation: |
https://www.mdpi.com/1424-8220/19/10/2384; https://doaj.org/toc/1424-8220 |
DOI: |
10.3390/s19102384 |
URL الوصول: |
https://doaj.org/article/83a00150b1a8434a88f458e59cf90a42 |
رقم الانضمام: |
edsdoj.83a00150b1a8434a88f458e59cf90a42 |
قاعدة البيانات: |
Directory of Open Access Journals |