Academic Journal
Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction
العنوان: | Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction |
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المؤلفون: | Wen Dai, Xing-Jie Ren, Qingwei Yan, Shengding Wang, Mingyang Yang, Le Lv, Junfeng Ying, Lu Chen, Peidi Tao, Liwen Sun, Chen Xue, Jinhong Yu, Chengyi Song, Kazuhito Nishimura, Nan Jiang, Cheng-Te Lin |
المصدر: | Nano-Micro Letters, Vol 15, Iss 1, Pp 1-14 (2022) |
بيانات النشر: | SpringerOpen, 2022. |
سنة النشر: | 2022 |
المجموعة: | LCC:Technology |
مصطلحات موضوعية: | Vertically aligned graphene, Liquid metal, Surface modification, Thermal interface materials, Technology |
الوصف: | Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides). The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude. |
نوع الوثيقة: | article |
وصف الملف: | electronic resource |
اللغة: | English |
تدمد: | 2311-6706 2150-5551 |
Relation: | https://doaj.org/toc/2311-6706; https://doaj.org/toc/2150-5551 |
DOI: | 10.1007/s40820-022-00979-2 |
URL الوصول: | https://doaj.org/article/c6a2fefd71224570b454bceb20fcd53a |
رقم الانضمام: | edsdoj.6a2fefd71224570b454bceb20fcd53a |
قاعدة البيانات: | Directory of Open Access Journals |
تدمد: | 23116706 21505551 |
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DOI: | 10.1007/s40820-022-00979-2 |