Academic Journal

Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics

التفاصيل البيبلوغرافية
العنوان: Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics
المؤلفون: Minwoo Kim, Hyungjun Lim, Seung Hwan Ko
المصدر: Advanced Science, Vol 10, Iss 6, Pp n/a-n/a (2023)
بيانات النشر: Wiley, 2023.
سنة النشر: 2023
المجموعة: LCC:Science
مصطلحات موضوعية: liquid metal, liquid metal patterning, soft electronics, Science
الوصف: Abstract Room‐temperature liquid metal (LM)‐based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM‐patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM‐based future soft electronics. First, essential considerations for LM‐patterning are investigated. Then, LM‐patterning methods—serial‐patterning, parallel‐patterning, intermetallic bond‐assisted patterning, and molding/microfluidic injection—are categorized and investigated. Finally, perspectives on LM‐based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM‐based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM‐based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2198-3844
Relation: https://doaj.org/toc/2198-3844
DOI: 10.1002/advs.202205795
URL الوصول: https://doaj.org/article/480f4465c1fd4f0b99e88281e4fdb87f
رقم الانضمام: edsdoj.480f4465c1fd4f0b99e88281e4fdb87f
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:21983844
DOI:10.1002/advs.202205795