Academic Journal

Precision Machining by Dicing Blades: A Systematic Review

التفاصيل البيبلوغرافية
العنوان: Precision Machining by Dicing Blades: A Systematic Review
المؤلفون: Zewei Yuan, Ali Riaz, Bilal shabbir Chohan
المصدر: Machines, Vol 11, Iss 2, p 259 (2023)
بيانات النشر: MDPI AG, 2023.
سنة النشر: 2023
المجموعة: LCC:Mechanical engineering and machinery
مصطلحات موضوعية: dicing blades, precision machining, surface roughness, process parameters, chipping, ridge waveguides, Mechanical engineering and machinery, TJ1-1570
الوصف: Diamond dicing blades are profound cutting tools that find their applications in semiconductor back-end packaging and assembly processes. To fully appreciate the benefits of the dicing blade technique for precision machining, a deeper understanding is required. This paper systematically reviews the contribution of dicing blades in machining, followed by the context of dicing blades: production, characterization, methodology, and optimization. The readers are enlightened about the potential prospects that can be exploited for precision spectra as a result of current research and engineering developments.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2075-1702
Relation: https://www.mdpi.com/2075-1702/11/2/259; https://doaj.org/toc/2075-1702
DOI: 10.3390/machines11020259
URL الوصول: https://doaj.org/article/2dbd6e238d8546c39f6268940a2505a4
رقم الانضمام: edsdoj.2dbd6e238d8546c39f6268940a2505a4
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:20751702
DOI:10.3390/machines11020259