التفاصيل البيبلوغرافية
العنوان: |
Precision Machining by Dicing Blades: A Systematic Review |
المؤلفون: |
Zewei Yuan, Ali Riaz, Bilal shabbir Chohan |
المصدر: |
Machines, Vol 11, Iss 2, p 259 (2023) |
بيانات النشر: |
MDPI AG, 2023. |
سنة النشر: |
2023 |
المجموعة: |
LCC:Mechanical engineering and machinery |
مصطلحات موضوعية: |
dicing blades, precision machining, surface roughness, process parameters, chipping, ridge waveguides, Mechanical engineering and machinery, TJ1-1570 |
الوصف: |
Diamond dicing blades are profound cutting tools that find their applications in semiconductor back-end packaging and assembly processes. To fully appreciate the benefits of the dicing blade technique for precision machining, a deeper understanding is required. This paper systematically reviews the contribution of dicing blades in machining, followed by the context of dicing blades: production, characterization, methodology, and optimization. The readers are enlightened about the potential prospects that can be exploited for precision spectra as a result of current research and engineering developments. |
نوع الوثيقة: |
article |
وصف الملف: |
electronic resource |
اللغة: |
English |
تدمد: |
2075-1702 |
Relation: |
https://www.mdpi.com/2075-1702/11/2/259; https://doaj.org/toc/2075-1702 |
DOI: |
10.3390/machines11020259 |
URL الوصول: |
https://doaj.org/article/2dbd6e238d8546c39f6268940a2505a4 |
رقم الانضمام: |
edsdoj.2dbd6e238d8546c39f6268940a2505a4 |
قاعدة البيانات: |
Directory of Open Access Journals |