Academic Journal

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations

التفاصيل البيبلوغرافية
العنوان: Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations
المؤلفون: Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee, Sungwook Mhin, Tae-Young Lee, Sehoon Yoo, Yong-Ho Ko, Dongjin Kim
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 6668-6685 (2024)
بيانات النشر: Elsevier, 2024.
سنة النشر: 2024
المجموعة: LCC:Mining engineering. Metallurgy
مصطلحات موضوعية: Laser soldering, Aluminum flexible printed circuit board, Electron backscatter diffraction (EBSD), Numerical simulation, Mining engineering. Metallurgy, TN1-997
الوصف: This study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering. Achieving a robust bonding strength of 65 MPa involved applying 600 W of laser power for 2 s, enhancing atom diffusion and promoting intermetallic compound (IMC) growth. Finite Element Method (FEM) simulations revealed variations in heat transfer between Al and Cu, affecting IMC thickness at interfaces. Formation of the (Cu, Ni)3Sn4 phase within solder, and variations in laser output significantly influenced solder joint orientation and Al electrode nucleation. Excessive laser power (>800 W) caused critical damage, such as delamination at the Al-PI interface, altering fracture modes and bonding strength. Furthermore, with a detailed examination of the laser soldering phenomenon through both experimental and numerical investigations, this study provides a thorough understanding of the different soldering mechanisms in conventional reflow soldering compared to instantaneous uniform large-area heat source laser soldering. These insights provide new design and material considerations to replace the conventional wiring harness with Al/Cu FPCB lap joints which optimize the circuitry and reducing BMS volume.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2238-7854
Relation: http://www.sciencedirect.com/science/article/pii/S2238785424011177; https://doaj.org/toc/2238-7854
DOI: 10.1016/j.jmrt.2024.05.077
URL الوصول: https://doaj.org/article/20087e7b6cdd42df9c1263e0277ab524
رقم الانضمام: edsdoj.20087e7b6cdd42df9c1263e0277ab524
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:22387854
DOI:10.1016/j.jmrt.2024.05.077