Academic Journal

Study on Recrystallization Process of Poly(DL-lactide)/Poly(ethylene glycol) Diblock Copolymer

التفاصيل البيبلوغرافية
العنوان: Study on Recrystallization Process of Poly(DL-lactide)/Poly(ethylene glycol) Diblock Copolymer
المؤلفون: Chen Xiaoqi, Bai Lu, Li Chengyu, Tian Jia, Zhou Haijun, Zhou Mengmeng, Xiao Jijun, Li Yantao
المصدر: MATEC Web of Conferences, Vol 358, p 01063 (2022)
بيانات النشر: EDP Sciences, 2022.
سنة النشر: 2022
المجموعة: LCC:Engineering (General). Civil engineering (General)
مصطلحات موضوعية: methoxypolyethylene glycols, dl-lactide, residual monomer, recrystallization, Engineering (General). Civil engineering (General), TA1-2040
الوصف: Poly (DL-lactide)/Poly (ethylene glycol) diblock copolymer is successfully synthesized with mPEG and DL-LA as main raw materials, and the residual monomers of the polymer were removed by recrystallization. FT-IR is used to characterize the structure of the polymer. Gas chromatography is used to determine the residual monomers and residual solvent of the polymer. The solubility of polymer in different solvents was determined, and the effect of different solvent systems on the removal of residual monomers in copolymer were discussed. The results showed that the Poly(DL-lactide)/Poly(ethylene glycol) diblock copolymer was recrystallized with acetone/ isopropyl ether solvent system has the best ability to remove residual monomers, and the residual monomers of the obtained polymer are less than 0.01 wt%, the total residual solvent is only 0.24 wt%, and the productivity is as high as 95.5 wt%.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
French
تدمد: 2261-236X
Relation: https://www.matec-conferences.org/articles/matecconf/pdf/2022/05/matecconf_msms2022_01063.pdf; https://doaj.org/toc/2261-236X
DOI: 10.1051/matecconf/202235801063
URL الوصول: https://doaj.org/article/ea09e85ceb0048e4ae9dd99e82bb0ace
رقم الانضمام: edsdoj.09e85ceb0048e4ae9dd99e82bb0ace
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:2261236X
DOI:10.1051/matecconf/202235801063