Academic Journal
Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation
العنوان: | Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation |
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المؤلفون: | Safee, Nur Shafiqa, Wan Yusoff, Wan Yusmawati, Ismail, Ariffin, Ismail, Norliza, Salleh, Emee Marina, Bakar, Maria Abu, Jalar, Azman |
المصدر: | IOP Conference Series: Materials Science and Engineering ; volume 409, page 012013 ; ISSN 1757-899X |
بيانات النشر: | IOP Publishing |
سنة النشر: | 2018 |
نوع الوثيقة: | article in journal/newspaper |
اللغة: | unknown |
DOI: | 10.1088/1757-899x/409/1/012013 |
الاتاحة: | http://dx.doi.org/10.1088/1757-899x/409/1/012013 http://stacks.iop.org/1757-899X/409/i=1/a=012013/pdf http://stacks.iop.org/1757-899X/409/i=1/a=012013?key=crossref.9a45f7b3ceba801d1a3827d2a2e09c29 |
Rights: | http://iopscience.iop.org/info/page/text-and-data-mining ; http://creativecommons.org/licenses/by/3.0/ |
رقم الانضمام: | edsbas.F163F913 |
قاعدة البيانات: | BASE |
DOI: | 10.1088/1757-899x/409/1/012013 |
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