Conference
Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management
| العنوان: | Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management |
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| المؤلفون: | Chow, W. L., Samani, M. K., Yap, Chin Chong, Tan, Dunlin, Shakerzadeh, Maziar, Brun, Christophe, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang |
| المساهمون: | School of Electrical and Electronic Engineering, IEEE MTT-S International Microwave Symposium Digest (2012 : Montreal, Canada), Research Techno Plaza |
| سنة النشر: | 2013 |
| المجموعة: | DR-NTU (Digital Repository at Nanyang Technological University, Singapore) |
| مصطلحات موضوعية: | DRNTU::Engineering::Electrical and electronic engineering |
| الوصف: | In order to meet the demands of increasing package density and miniaturization of devices without compromising performance, the most challenging issues to tackle are thermal and interconnect management. In this paper, we will first understand the interfacial transport between Si and Carbon for better system integration and discuss how novel carbon films can be used for thermal extraction. Second, we will show how carbon nanotubes can be used as interconnects using a flip chip approach as well as potential radio frequency applications. |
| نوع الوثيقة: | conference object |
| اللغة: | English |
| Relation: | https://hdl.handle.net/10356/98763; http://hdl.handle.net/10220/13451 |
| DOI: | 10.1109/MWSYM.2012.6259415 |
| الاتاحة: | https://hdl.handle.net/10356/98763 http://hdl.handle.net/10220/13451 https://doi.org/10.1109/MWSYM.2012.6259415 |
| Rights: | © 2012 IEEE |
| رقم الانضمام: | edsbas.E468164 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/MWSYM.2012.6259415 |
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