Conference
Characterization and Optimization of Single Wafer Processing Equipment with Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes
| العنوان: | Characterization and Optimization of Single Wafer Processing Equipment with Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes |
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| المؤلفون: | Kirk, Simon, Tse, Chiu, Wang, Eric, Wu, Cooper, Wong, Sang Min, Henry, Sally Ann, Archer, Leo, West, Jason, Cakmak, Erkan |
| المصدر: | 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ; page 228-232 ; ISSN 1078-8743 |
| بيانات النشر: | IEEE |
| سنة النشر: | 2008 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/asmc.2008.4529043 |
| الاتاحة: | http://dx.doi.org/10.1109/asmc.2008.4529043 http://xplorestaging.ieee.org/ielx5/4519622/4528988/04529043.pdf?arnumber=4529043 |
| رقم الانضمام: | edsbas.CBA9D1E8 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/asmc.2008.4529043 |
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