Emerging trends in OBIC characterization technique for Wide Bandgap semiconductor devices

التفاصيل البيبلوغرافية
العنوان: Emerging trends in OBIC characterization technique for Wide Bandgap semiconductor devices
المؤلفون: Planson, Dominique, Sonneville, Camille, Bevilacqua, Pascal, Tournier, Dominique
المساهمون: Ampère, Département Energie Electrique (EE), Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), IMT Bucharest
المصدر: International Semiconductor Conference (CAS-2023) ; https://hal.science/hal-04238355 ; International Semiconductor Conference (CAS-2023), IMT Bucharest, Oct 2023, Sinaia, Romania. pp.3-10, ⟨10.1109/CAS59036.2023.10303647⟩
بيانات النشر: HAL CCSD
IEEE
سنة النشر: 2023
المجموعة: HAL Lyon 1 (University Claude Bernard Lyon 1)
مصطلحات موضوعية: optical device characterization, power devices, high voltage device, periphery protection, Silicon Carbide, OBIC, [SPI.NRJ]Engineering Sciences [physics]/Electric power
جغرافية الموضوع: Sinaia, Romania
الوصف: Wide-bandgap semiconductors, like silicon carbide (SiC), gallium nitride (GaN), and diamond (C), outperform silicon (Si) based power electronic devices. However, the peripheral protection of these wide-bandgap devices needs to be carefully designed to handle high voltage. This article demonstrates the potential of using the OBIC (Optical Beam Induced Current) technique to analyze different protection methods' effectiveness and provide feedback to device designers regarding peripheral termination efficiency. At the beginning, the article presents a theoretical approach to introduce the OBIC method. Subsequently, the electro-optical characterization technique is applied to high-voltage power devices within a vacuum chamber, enabling the examination of the electric field's spatial distribution in the semiconductor. The focus is on SiC devices due to their availability. Throughout the years, this technique has evolved, with advancements made in reducing spot size and enhancing sample placement precision. The article will also showcase new results obtained from components with new-generation peripheral protection.
نوع الوثيقة: conference object
اللغة: English
Relation: hal-04238355; https://hal.science/hal-04238355; https://hal.science/hal-04238355/document; https://hal.science/hal-04238355/file/obic_planson.pdf
DOI: 10.1109/CAS59036.2023.10303647
الاتاحة: https://hal.science/hal-04238355
https://hal.science/hal-04238355/document
https://hal.science/hal-04238355/file/obic_planson.pdf
https://doi.org/10.1109/CAS59036.2023.10303647
Rights: info:eu-repo/semantics/OpenAccess
رقم الانضمام: edsbas.C70D1E17
قاعدة البيانات: BASE
الوصف
DOI:10.1109/CAS59036.2023.10303647