Conference
Numerical Analysis on Stress and Strain in QFP Lead-Free Solder with Temperature Impact
| العنوان: | Numerical Analysis on Stress and Strain in QFP Lead-Free Solder with Temperature Impact |
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| المؤلفون: | Li, Zhi, Zhao, Mei-rong, You, Min, Lu, Wei-bin, Wang, Yun-Tao |
| المصدر: | 2009 International Conference on Energy and Environment Technology ; page 214-217 |
| بيانات النشر: | IEEE |
| سنة النشر: | 2009 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/iceet.2009.58 |
| الاتاحة: | http://dx.doi.org/10.1109/iceet.2009.58 http://xplorestaging.ieee.org/ielx5/5362516/5362519/05362706.pdf?arnumber=5362706 |
| رقم الانضمام: | edsbas.C2BB3000 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/iceet.2009.58 |
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