التفاصيل البيبلوغرافية
| العنوان: |
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints |
| المؤلفون: |
Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés, Oliver Krammer |
| المصدر: |
Materials; Volume 14; Issue 24; Pages: 7909 |
| بيانات النشر: |
Multidisciplinary Digital Publishing Institute |
| سنة النشر: |
2021 |
| المجموعة: |
MDPI Open Access Publishing |
| مصطلحات موضوعية: |
solder flux, reflow soldering, SAC solder alloy, solder mask, surface finish |
| الوصف: |
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%. |
| نوع الوثيقة: |
text |
| وصف الملف: |
application/pdf |
| اللغة: |
English |
| Relation: |
Metals and Alloys; https://dx.doi.org/10.3390/ma14247909 |
| DOI: |
10.3390/ma14247909 |
| الاتاحة: |
https://doi.org/10.3390/ma14247909 |
| Rights: |
https://creativecommons.org/licenses/by/4.0/ |
| رقم الانضمام: |
edsbas.BA5E5652 |
| قاعدة البيانات: |
BASE |