Academic Journal
The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
| العنوان: | The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique |
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| المؤلفون: | Van Olmen, J., Manca, J.V., De Ceuninck, W., De Schepper, L., D’Haeger, V., Witvrouw, A., Maex, K., Vandevelde, B., Beyne, E., Tielemans, L. |
| المصدر: | Microelectronics Reliability ; volume 39, issue 11, page 1657-1665 ; ISSN 0026-2714 |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 1999 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/s0026-2714(99)00168-7 |
| الاتاحة: | http://dx.doi.org/10.1016/s0026-2714(99)00168-7 https://api.elsevier.com/content/article/PII:S0026271499001687?httpAccept=text/xml https://api.elsevier.com/content/article/PII:S0026271499001687?httpAccept=text/plain |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ |
| رقم الانضمام: | edsbas.B7749CCE |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/s0026-2714(99)00168-7 |
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