Academic Journal
Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment
| العنوان: | Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment |
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| المؤلفون: | Luo, Ruidong, Yu, Xiaoli, Wu, Zhen, Zhang, Hao, Liu, Zhi-Quan, Suganuma, Katsuaki, Li, Cai-Fu |
| المصدر: | Materials Letters: X ; volume 13, page 100124 ; ISSN 2590-1508 |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 2022 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/j.mlblux.2022.100124 |
| الاتاحة: | http://dx.doi.org/10.1016/j.mlblux.2022.100124 https://api.elsevier.com/content/article/PII:S2590150822000047?httpAccept=text/xml https://api.elsevier.com/content/article/PII:S2590150822000047?httpAccept=text/plain |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ ; http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| رقم الانضمام: | edsbas.B44B13AF |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.mlblux.2022.100124 |
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