Academic Journal

Etching of deep macropores in 6 in. Si wafers

التفاصيل البيبلوغرافية
العنوان: Etching of deep macropores in 6 in. Si wafers
المؤلفون: Meerakker, JEAM van de, Elfrink, RJG, Roozeboom, F Fred, Verhoeven, JFCM
المصدر: ISSN:0013-4651.
سنة النشر: 2000
المجموعة: Eindhoven University of Technology (TU/e): Research Portal
الوصف: The process of photoanodic etching of deep pores in lightly doped n - -Si wafers was investigated. On a 6 in. wafer, more than 1 billion pores, regularly distributed over the wafer in a hexagonal array with a pitch of 3.5 μm, were obtained using an electrolytic back contact. The diameter of the pores was about 2 μm and depths up to 400 μm could be achieved. Kinetic experiments revealed that the etching process was diffusion controlled in a solution containing HF, H 2 O, and ethanol. Electrochemical experiments showed that H 2 evolution took place at the back side of the Si wafer and that H 2 and O 2 evolved at the Pt cathode and anode, respectively.
نوع الوثيقة: article in journal/newspaper
وصف الملف: application/pdf
اللغة: English
Relation: http://repository.tue.nl/901870
الاتاحة: http://repository.tue.nl/901870
Rights: Copyright (c) Meerakker, JEAM van de ; Copyright (c) Elfrink, RJG ; Copyright (c) Roozeboom, F Fred ; Copyright (c) Verhoeven, JFCM
رقم الانضمام: edsbas.B34DDD2E
قاعدة البيانات: BASE