Academic Journal
Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn-90-Bi-10 and Bi-88-Zn-12 based ternary alloys
| العنوان: | Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn-90-Bi-10 and Bi-88-Zn-12 based ternary alloys |
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| المؤلفون: | Esener, Pinar Ata, Altintas, Yemliha, Bayram, Umit, Ozturk, Esra, Marasli, Necmettin, Aksoz, Sezen |
| المساهمون: | AGÜ, Mühendislik Fakültesi, Malzeme Bilimi ve Nanoteknoloji Mühendisliği Bölümü, orcid:0000-0002-1993-2655, orcid:0000-0001-8760-8024 |
| بيانات النشر: | SPRINGER, VAN GODEWIJCKSTRAAT 30, 3311 GZ DORDRECHT, NETHERLANDS |
| سنة النشر: | 2019 |
| مصطلحات موضوعية: | ADDITIONS, TEMPERATURE, ZN, BI-SN |
| الوصف: | Nevsehir Haci Bektas Veli University Research Foundation was provided the funding of this study under Contract No: NEUADP15F18. The researchers thank to the university for the support. ; The thermal conductivity variations with temperature for Zn90-x-Sn-x-Bi10 (x=5,10, 40 and 85wt%) and Bi88-x-Sn-x-Zn-12 (x=1.39, 43.26 and 79.3wt%) alloys were measured by using the linear heat flow method. From thermal conductivity-temperature plots, the coefficients of thermal conductivity for the Zn-Sn-Bi alloys were calculated. The microstructures of Zn-Sn-Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn-Sn-Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device. ; Nevsehir Haci Bektas Veli University NEUADP15F18 |
| نوع الوثيقة: | article in journal/newspaper |
| وصف الملف: | application/pdf |
| اللغة: | English |
| تدمد: | 0957-4522 1573-482X |
| Relation: | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; Makale - Uluslararası - Editör Denetimli Dergi; https://doi.org/10.1007/s10854-018-00648-4; https://hdl.handle.net/20.500.12573/635; Volume: 30; 3678; 3691 |
| DOI: | 10.1007/s10854-018-00648-4 |
| الاتاحة: | https://hdl.handle.net/20.500.12573/635 https://doi.org/10.1007/s10854-018-00648-4 |
| Rights: | info:eu-repo/semantics/closedAccess |
| رقم الانضمام: | edsbas.A114A2E |
| قاعدة البيانات: | BASE |
| تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-018-00648-4 |