Academic Journal
End of life and acceleration modelling for power diodes under high temperature reverse bias stress
| العنوان: | End of life and acceleration modelling for power diodes under high temperature reverse bias stress |
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| المؤلفون: | Schilling, O., Leitner, K., Schulze, K.-D., Umbach, F. |
| المصدر: | Microelectronics Reliability ; volume 64, page 458-463 ; ISSN 0026-2714 |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 2016 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/j.microrel.2016.07.137 |
| الاتاحة: | http://dx.doi.org/10.1016/j.microrel.2016.07.137 https://api.elsevier.com/content/article/PII:S0026271416302815?httpAccept=text/plain https://api.elsevier.com/content/article/PII:S0026271416302815?httpAccept=text/xml |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ |
| رقم الانضمام: | edsbas.93308123 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.microrel.2016.07.137 |
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