Academic Journal
Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
| العنوان: | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
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| المؤلفون: | Quadir, Zakaria, Singh, G., Rickard, William, Haseeb, A.S.M.A. |
| بيانات النشر: | ELSEVIER |
| سنة النشر: | 2020 |
| المجموعة: | Curtin University: espace |
| مصطلحات موضوعية: | Science & Technology, Technology, Physical Sciences, Materials Science, Multidisciplinary, Physics, Applied, FAB bonding, EBSD, TKD, Laser treatment, Gold, Copper, COLD, DIFFRACTION, MICROBANDS |
| الوصف: | © 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. |
| نوع الوثيقة: | article in journal/newspaper |
| وصف الملف: | restricted |
| اللغة: | English |
| Relation: | http://hdl.handle.net/20.500.11937/82057 |
| DOI: | 10.1016/j.matlet.2019.126833 |
| الاتاحة: | https://hdl.handle.net/20.500.11937/82057 https://doi.org/10.1016/j.matlet.2019.126833 |
| رقم الانضمام: | edsbas.8EBAD8E5 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.matlet.2019.126833 |
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