Academic Journal
A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs
| العنوان: | A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs |
|---|---|
| المؤلفون: | Zhao, Biyao, Hardin, Keith B., Hosseinbeig, Ahmad, Cao, Ying S., Dikhaminjia, Nana, Kratzer, Zach, Fessler, John, Drewniak, James L. |
| المصدر: | Electrical and Computer Engineering Faculty Research & Creative Works |
| بيانات النشر: | Scholars' Mine |
| سنة النشر: | 2017 |
| المجموعة: | Missouri University of Science and Technology (Missouri S&T): Scholars' Mine |
| مصطلحات موضوعية: | Capacitors, Ceramic Capacitors, Electric Network Analysis, Equivalent Circuits, Decoupling Capacitor, Multi-Layer Ceramic Capacitor, PDN Noise, Power Distribution Network, Power Distribution Network Design, Power Distribution Network Impedance, Voltage Ripples, Z-Directed Component (ZDC), Printed Circuit Boards, Equivalent Circuit, Switch Current, Voltage Ripple, Electrical and Computer Engineering |
| الوصف: | A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors. |
| نوع الوثيقة: | text |
| اللغة: | unknown |
| Relation: | https://scholarsmine.mst.edu/ele_comeng_facwork/2705; https://doi.org/10.1109/MEMC.0.8093847 |
| DOI: | 10.1109/MEMC.0.8093847 |
| الاتاحة: | https://scholarsmine.mst.edu/ele_comeng_facwork/2705 https://doi.org/10.1109/MEMC.0.8093847 |
| Rights: | © 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved. |
| رقم الانضمام: | edsbas.85E5FEA8 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/MEMC.0.8093847 |
|---|